{"code":200,"return":true,"data":{"live":[{"id":283,"categoryid":33,"live_data":{"name":"基于高频特性的快速入门EMC分析设计方法","desc":"直播结束后扫码添加助教领取课件直播介绍：","templatetype":2,"authtype":2,"publisherpass":793944,"assistantpass":793944,"foreignpublish":"0","openhostmode":0,"hostloginmode":0,"barrage":"","livestarttime":"2025-06-27 20:00","publishurls":[]},"roomid":"011EEB3D0A75A2B19C33DC5901307461","title":"基于高频特性的快速入门EMC分析设计方法","price":"0.00","thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/ab\/069a61f8f30bba9081f4216ea452b1.jpg","orderby":0,"audit":0,"createtime":"2025-06-26 09:58:57","updatetime":"2026-04-22 18:41:16","desc":"直播结束后扫码添加助教领取课件直播介绍：1小时掌握EMC分析的底层逻辑，彻底搞懂“电磁兼容”到底怎么设计！你还在为EMC问题头疼吗？一堆干扰源、一堆管控措施，却总抓不到重点？这场直播，教你一套“高频视角+三段论” EMC 快速分析法，不看资","content":"

直播结束后<\/font><\/p>

扫码添加助教领取课件<\/b><\/font><\/p>

\"1c41841f13c31cd5c1230e8428a7dc.png\"<\/font><\/p>


<\/font><\/p>

直播介绍：<\/b><\/font><\/p>1小时掌握EMC分析的底层逻辑，彻底搞懂“电磁兼容”到底怎么设计！<\/font>
<\/font>你还在为EMC问题头疼吗？<\/font>一堆干扰源、一堆管控措施，却总抓不到重点？<\/font>这场直播，教你一套“高频视角+三段论” EMC 快速分析法，<\/font>不看资料、不跑仿真，也能快速判断干扰路径和设计缺陷！<\/font>
<\/font>
<\/font>直播大纲：<\/b><\/font>

第一节：EMC的高频特性思维基础<\/b><\/font><\/p>1）为什么说EMC问题本质是“高频信号管理问题”？<\/font>2）高频环境下，电磁干扰是怎么形成的？<\/font>
<\/font>第二节：导线的高频等效电路图<\/b><\/font>1）普通一根线，高频下却“藏满地雷”？<\/font>2）等效模型一看就懂！<\/font>
<\/font>第三节：三段论 EMC 快速分析法（独家思维模型）<\/b><\/font>1）高频特性认知<\/font>2）回流路径判断<\/font>3）电压容限评估<\/font>→ 用“结构化思维”，拆解复杂EMC问题！<\/font>
<\/font>第四节：实战案例讲解——三段论分析法如何落地？<\/b><\/font>真实设计案例，现场带你分析干扰源&对策逻辑<\/font>
<\/font>第五节：<\/b>课后自检——这套方法，是否也适合你？<\/font>
<\/b><\/font>
<\/font>直播亮点：<\/b><\/font>✅ 工程化思维总结：三段论=分析框架+经验窍门<\/font>✅ 0门槛入门EMC：听得懂、记得住、用得上<\/font>✅ 1小时重构你的EMC认知模型<\/font>✅ 不是“EMC百科全书”，而是“方法论工具包”！<\/font>
<\/font>
","views":5939,"uid":144040,"tags":["EMC","电磁兼容","高频","电磁干扰","安规"],"status":2,"reject":null,"playstatus":3,"playtime":"2025-06-27 20:00:00","count":1,"comments":0,"likes":1,"collects":6,"hasreplay":1,"deletetime":null,"isnotify":0,"isgiveintegral":1},{"id":282,"categoryid":16,"live_data":{"name":"反激电源TL431+光耦反馈参数计算全解析","desc":"直播结束后扫码添加助教领取课件直播介绍：","templatetype":2,"authtype":2,"publisherpass":622800,"assistantpass":622800,"foreignpublish":"0","openhostmode":0,"hostloginmode":0,"barrage":"","livestarttime":"2025-06-13 20:00","publishurls":[]},"roomid":"1C2E8CE3013989A69C33DC5901307461","title":"反激电源TL431+光耦反馈参数计算全解析","price":"0.00","thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/6a\/02fabcfba43b640b6802fdde12c4a1.jpg","orderby":0,"audit":0,"createtime":"2025-06-11 17:38:11","updatetime":"2026-04-22 17:32:24","desc":"直播结束后扫码添加助教领取课件直播介绍：随着电源技术和能源技术的发展，反激开关电源在100W以内的领域占据主导地位。其主流控制方式是变压器隔离副边反馈控制。因此，掌握逆变技术势在必行。直播大纲：1：TL431+ PC817规格书解读2：电压","content":"

直播结束后<\/font><\/p>

扫码添加助教领取课件<\/b><\/font><\/p>

\"1c41841f13c31cd5c1230e8428a7dc.png\"<\/font><\/p>


<\/font><\/p>

直播介绍：<\/b><\/font><\/p>

随着电源技术和能源技术的发展，反激开关电源在100W以内的领域占据主导地位。其主流控制方式是变压器隔离副边反馈控制。因此，掌握逆变技术势在必行。<\/font><\/p>


<\/font><\/p>

直播大纲：<\/b><\/font><\/p>

1：TL431+ PC817规格书解读
2：电压反馈电阻计算取值
3：光耦的电流输出曲线工作点设置
4：TL431+光耦偏置电阻的计算
5：电压波动占空比整体调节变化
<\/font><\/p>


<\/font><\/p>

主要讲了哪些知识点：<\/b><\/font><\/p>

1：TL431器件内部框图和规格书解读
2：PC817规格书解读
3：UC384X内部反馈控制逻辑解读
4：电压反馈电阻计算取值
5：TL431+光耦偏置电阻的计算
6：光耦的电流输出曲线工作点设置
7：电压环两种经典反馈电路介绍
8：电压波动，占空比控制的整体调节
<\/font><\/p>


<\/font><\/p>

能掌握哪些内容：<\/b><\/font><\/p>

1：掌握TL431+PC817器件特性
2：掌握TL431+PC817反馈的调节原理
3：TL431+PC817外围参数计算
4：掌握UC384X内部框图反馈调节思路
5：反馈参数计算取值需要验算
6：能读懂PC817电流传输曲线图
<\/font><\/p>

\"a3c975d82aa5628952e6886902bf76.png\"<\/p>

\"669aa5f7b959c82b42e0d8aec3d07d.png\"<\/p>

\"3cfc6cbeaad940bdf773f72934baf4.png\"<\/p>","views":5062,"uid":2286,"tags":["反激电源","开关电源","光耦","TL431","变压器"],"status":2,"reject":null,"playstatus":3,"playtime":"2025-06-13 20:00:00","count":1,"comments":0,"likes":1,"collects":14,"hasreplay":1,"deletetime":null,"isnotify":0,"isgiveintegral":1},{"id":281,"categoryid":6,"live_data":{"name":" Allegro 6层实战直播 RK3576主板全流程解析","desc":"直播结束后扫码添加助教领取课件【直播介绍","templatetype":2,"authtype":2,"publisherpass":994211,"assistantpass":994211,"foreignpublish":"0","openhostmode":0,"hostloginmode":0,"barrage":"","livestarttime":"2025-04-11 20:00","publishurls":[]},"roomid":"BDA160DB812C47B19C33DC5901307461","title":" Allegro 6层实战直播 RK3576主板全流程解析","price":"0.00","thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/c4\/6830fdc91e2ba1a50d4ce4ae68254a.jpg","orderby":0,"audit":0,"createtime":"2025-03-31 17:45:16","updatetime":"2026-04-22 17:26:27","desc":"直播结束后扫码添加助教领取课件【直播介绍】：4月11日晚（20:00）起，每周五连续6期直播课，由黄勇老师讲授系列课程：6层RK3576主板全流程实战核心设计解析，本期为第一节直播课。本系列直播课程基于全新的软件Allegro24.1，将带","content":"

直播结束后<\/font><\/p>

扫码添加助教领取课件<\/b><\/font><\/p>

\"1c41841f13c31cd5c1230e8428a7dc.png\"<\/p>

 <\/font><\/p>

【直播介绍】：<\/b><\/font><\/p>

4月11日晚（20:00）起，每周五连续6期<\/b>直播课，由黄勇老师讲授系列课程：6层<\/font><\/b>RK3576主板全流程实战核心设计解析，本期为第一节直播课。<\/strong><\/font><\/p>


<\/strong><\/font><\/p>

本系列直播课程基于全新的软件Allegro24.1，将带你深入解析 6层RK3576主板设计<\/font><\/strong> 的核心要点，从项目规划到完整设计流程，帮助你掌握高速PCB设计的关键技能！重点讲解 整板设计优化与验证<\/font><\/strong>，包括 电源完整性（PI）、信号完整性（SI）、高速信号布线、射频电路设计及常见问题排查<\/strong><\/font>，确保设计达到工业级标准。
<\/strong><\/font><\/p>


<\/p>

【分享有礼，惊喜不停】<\/b>
\n只需连续六场直播都将海报图文转发至朋友圈，即可轻松领取双重好礼：<\/font><\/p>

✅ 100元凡亿课程无门槛现金抵扣券<\/strong>
\n——可直接用于凡亿官方平台购课，立减100元，学习更省钱！<\/font><\/p>

✅ 凡亿定制多功能小风扇<\/strong>
\n——手持、桌面、支架三合一，夏日必备神器，清凉又实用！<\/font><\/p>

\n\n\n<\/p>

坚持分享，就是收获！赶紧行动吧，福利等你来拿～<\/font><\/p>

\"0f82ce869554ed2e47f03a4b10f005.jpg\"
<\/font><\/p>


<\/p>

【直播竞答 · 好礼送不停】<\/b>
\n观看直播，即有机会参与有奖答题环节<\/strong>！答对问题，就能把精美好礼带回家<\/font><\/p>

🏆 奖品包含：
<\/font>✅凡亿定制多功能小风扇<\/strong>（手持｜桌面｜支架三用）
<\/font>✅ 30CM PCB工程师专用沉金直尺<\/strong>，实用又有范！<\/font><\/p>

\n\n<\/p>

 所有奖品 包邮到家<\/strong><\/font><\/p>

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\"049a4bea21248b22d9239e83a93bd0.png\"<\/font><\/p>

\"7eac53eb227ebcd292d0f8d5659c0e.png\"<\/p>

\"2cd5abbfef4edb0d664e7229ed7c64.png\"<\/p>","views":14409,"uid":75,"tags":["RK3576","主板设计","电源完整性","高速信号","布局布线"],"status":2,"reject":null,"playstatus":3,"playtime":"2025-05-23 20:00:00","count":6,"comments":2,"likes":7,"collects":52,"hasreplay":1,"deletetime":null,"isnotify":0,"isgiveintegral":1},{"id":280,"categoryid":5,"live_data":{"name":"手机20W PD快充Layout全流程解析","desc":"直播结束后扫码添加助教领取课件直播介绍：","templatetype":2,"authtype":2,"publisherpass":935644,"assistantpass":935644,"foreignpublish":"0","openhostmode":0,"hostloginmode":0,"barrage":"","livestarttime":"2025-03-21 20:00","publishurls":[]},"roomid":"76AE7BA5367B87FE9C33DC5901307461","title":"手机20W PD快充Layout全流程解析","price":"0.00","thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/c8\/3eb3c54ef5baa8460f926ec5e5d82b.jpg","orderby":0,"audit":0,"createtime":"2025-03-20 14:53:48","updatetime":"2026-04-22 17:34:02","desc":"直播结束后扫码添加助教领取课件直播介绍：本次直播将深入解析手机20W PD快充的Layout设计关键点，涵盖从原理图分析到实际布线的完整流程。我们将讲解安规要求、布局与布线技巧，并通过实操演示，让你掌握高效的PCB设计方法，助力快充方案落地","content":"

直播结束后<\/p>

扫码添加助教领取课件<\/b><\/p>

 \"da3e2d7916fccb45c766851939a87a.png\"<\/p>


<\/p>

直播介绍：<\/b>
本次直播将深入解析手机20W PD快充的Layout设计关键点，涵盖从原理图分析到实际布线的完整流程。我们将讲解安规要求、布局与布线技巧，并通过实操演示，让你掌握高效的PCB设计方法，助力快充方案落地。<\/span><\/font><\/p>


直播大纲：<\/b>
1、20W PD快充原理图解析 <\/b>—— 关键电路模块与工作原理剖析<\/span>
2、安规设计讲解 <\/b>—— 满足快充安全标准的设计要点<\/span>
3、PCB布局技巧<\/b> —— 关键器件摆放原则与优化策略<\/span>
4、PCB布线要点<\/b> —— 高速信号、电源走线及EMC优化<\/span>
5、Layout实操演示<\/b> —— 基于案例完成完整PCB设计<\/span>
<\/font><\/p>\"05a8836d940698508b38ed0d5e99ee.png\"
\"dae352b66a6b4cf381f08d38796fc3.png\"","views":7900,"uid":53688,"tags":["layout","快充","安规设计","PCB布局","PCB布线"],"status":2,"reject":null,"playstatus":3,"playtime":"2025-03-21 20:00:00","count":1,"comments":0,"likes":6,"collects":24,"hasreplay":1,"deletetime":null,"isnotify":0,"isgiveintegral":1}],"newCourse":[{"id":22171,"uid":24529,"title":"Cadence Orcad X and Allegro X 25.1安装视频","desc":"电子设计资料扫码领取","price":"0.00","content":"

电子设计资料<\/p>

扫码领取<\/p>

\"dd45a63b4261f9442395e6a1a6f07d.png\"<\/p>","orderby":0,"categoryid":6,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/66\/5bb2d5fa15a3bbed9945c27ad3d520.png","buycount":12,"count":1,"likes":0,"views":115,"comments":0,"collects":0,"reject":null,"invite":0,"createtime":"2026-04-02 10:08:52","updatetime":"2026-04-22 16:17:35","deletetime":null,"tags":["Cadence","Orcad","安装教程","allgro"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22170,"uid":24529,"title":"Altium Designe25 2层国产GD32开发板PCB设计入门实战课程","desc":"课程配套的素材链接扫码领取","price":"129.00","content":"

课程配套的素材链接<\/p>

扫码领取<\/p>

\"dd45a63b4261f9442395e6a1a6f07d.png\"<\/p>","orderby":0,"categoryid":12,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/26\/f4fd696aec3b1fa6427b0fad496bc4.png","buycount":8,"count":49,"likes":0,"views":292,"comments":0,"collects":1,"reject":null,"invite":0,"createtime":"2026-04-01 16:30:45","updatetime":"2026-04-22 17:19:57","deletetime":null,"tags":["GD32","AD25","原理图","PCB封装","电源"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22169,"uid":24529,"title":"国产软件三微EDA零基础PCB设计入门课程","desc":"扫码添加助教领取配套的课件","price":"0.00","content":"

扫码添加助教<\/p>

领取配套的课件<\/p>

\"dd45a63b4261f9442395e6a1a6f07d.png\"<\/p>","orderby":0,"categoryid":11,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/8b\/bd8015357ac1d28962eb8f98471852.jpg","buycount":106,"count":76,"likes":0,"views":883,"comments":0,"collects":4,"reject":null,"invite":0,"createtime":"2026-03-06 17:14:09","updatetime":"2026-04-22 14:25:12","deletetime":null,"tags":["三微电子","EDA","PCB设计"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22168,"uid":2286,"title":"数字电路","desc":"","price":"0.00","content":"

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\"d42b716b9e23436c7635fb09dcd257.png\"<\/p>","orderby":0,"categoryid":97,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/c3\/9605a87d29d71f809944bc62d023a9.jpg","buycount":108,"count":20,"likes":1,"views":1244,"comments":0,"collects":20,"reject":null,"invite":0,"createtime":"2025-12-24 17:27:07","updatetime":"2026-04-22 16:31:37","deletetime":null,"tags":["数字信号","数字电路"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22167,"uid":30525,"title":"第二期--90天微波频综与收发机系统整体","desc":"频综第二期视频回放","price":"6999.00","content":"

频综第二期视频回放 <\/p>","orderby":0,"categoryid":17,"status":1,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/1d\/4b6114ddc09c5e1a6d28d61574490a.jpg","buycount":12,"count":27,"likes":1,"views":1066,"comments":0,"collects":2,"reject":null,"invite":0,"createtime":"2025-12-20 09:23:05","updatetime":"2026-04-21 18:29:22","deletetime":null,"tags":["微波","射频","天线","5G","HFSS"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22166,"uid":24529,"title":"PCB软件操作速成合集（AD\/Allegro\/Pads）","desc":"素材课件扫码添加领取","price":"9.90","content":"

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\"49fc4bd2c6b988e19f22e319c5f115.png\"<\/p>","orderby":0,"categoryid":48,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/32\/9c1e874ab0dfc38091d9e5fcddf4d6.jpg","buycount":149,"count":56,"likes":2,"views":1561,"comments":0,"collects":34,"reject":null,"invite":0,"createtime":"2025-12-09 17:15:34","updatetime":"2026-04-22 11:24:34","deletetime":null,"tags":["模拟电路","模拟电路视频","模拟电路教程"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22164,"uid":144040,"title":"EMC电磁兼容入门系统教学","desc":"","price":"0.00","content":"

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\"db40085366f7ce874386b18aafabe8.png\"<\/p>","orderby":0,"categoryid":33,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/f8\/102f49250be495ceac957e4ed560df.jpg","buycount":90,"count":6,"likes":1,"views":1028,"comments":0,"collects":21,"reject":null,"invite":0,"createtime":"2025-11-25 15:35:16","updatetime":"2026-04-22 16:40:19","deletetime":null,"tags":["EMC","EMC入门","EMC入门教程"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22163,"uid":24529,"title":"Altium Designer Query查询语句的编写及检测","desc":"免费技术群扫码添加\n助教\n微信\n\n\n备注：进群","price":"0.00","content":"

 免费技术群扫码添加\n助教\n微信\n<\/p>

\n<\/p>

\n备注：进群 <\/p>

\"1c41841f13c31cd5c1230e8428a7dc.png\"<\/p>","orderby":0,"categoryid":5,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/22\/bdef19cf02f637afc40bb8cf1daa8d.jpg","buycount":171,"count":1,"likes":0,"views":1731,"comments":0,"collects":8,"reject":null,"invite":0,"createtime":"2025-11-14 22:48:56","updatetime":"2026-04-22 11:15:48","deletetime":null,"tags":["Altium Designer25","Query查询","Query查询语句"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22162,"uid":24529,"title":"【延班】90天射频天线直播群","desc":"延班回放视频","price":"6999.00","content":"

延班回放视频<\/p>","orderby":0,"categoryid":17,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/61\/3bf1af5431714968b1243faf6a5a02.jpg","buycount":11,"count":12,"likes":0,"views":1245,"comments":0,"collects":2,"reject":null,"invite":0,"createtime":"2025-11-11 13:47:49","updatetime":"2026-04-22 01:42:54","deletetime":null,"tags":["射频","天线","微波","频综","HFSS"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22161,"uid":24529,"title":"Altium Designer 26 (Agile) 官方标准安装教程｜完整流程教程","desc":"\nAD最新软件版本首发来咯\n\n扫码领【安装包】","price":"0.00","content":"\nAD最新软件版本首发来咯<\/font>

\n<\/p>

\n<\/p>扫码领【安装包】<\/font>

\"1c41841f13c31cd5c1230e8428a7dc.png\"<\/p>","orderby":0,"categoryid":5,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/0d\/fd9756bd8bdafa52530f836e98b67a.jpg","buycount":82,"count":1,"likes":0,"views":1193,"comments":0,"collects":2,"reject":null,"invite":0,"createtime":"2025-11-11 11:12:39","updatetime":"2026-04-22 17:42:23","deletetime":null,"tags":["AD26","AD26Agile","Altium安装","AD26新手教程","软件安装"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22160,"uid":175317,"title":"高导热导电银胶AS6585：大功率LED封装的核心材料解析","desc":"高导热导电银胶AS6585：大功率LED封装的核心材料解析","price":"0.00","content":"

高导热导电银胶AS6585：大功率LED封装的核心材料解析<\/p>","orderby":0,"categoryid":86,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/80\/b7086d38f8e4b0dfcc2a1183010341.jpg","buycount":8,"count":1,"likes":0,"views":391,"comments":0,"collects":0,"reject":null,"invite":0,"createtime":"2025-11-07 09:26:23","updatetime":"2026-04-22 15:35:07","deletetime":null,"tags":["高导热","烧结银","导电胶"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"}],"goodcourse":[{"id":21028,"uid":58261,"title":"凡亿教育20天嘉立创EDA专业版PCB设计线上特训营","desc":"下单后扫码助教老师拉入特训营群学习添加时备注：20天","price":"68.80","content":"

下单后扫码助教老师拉入特训营群学习<\/p>

添加时备注：20天<\/b><\/p>

\"124e2ef3f76c9e29a8b7a9ce5384b8.png\"<\/p>

\"ca60184d23f6889371688411af21d0.jpg\"\"fab9834a96318049179a8f29100a87.jpg\"<\/p>","orderby":0,"categoryid":9,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/8a\/264a1af94d00a1e6827765f635aa1d.jpg","buycount":628,"count":137,"likes":0,"views":30264,"comments":8,"collects":89,"reject":null,"invite":0,"createtime":"2022-11-03 17:55:05","updatetime":"2026-04-22 18:40:48","deletetime":null,"tags":["原理图设计","立创EDA","PCB设计","电路设计"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":"course_699","ipaprice":"69.90"},{"id":21362,"uid":30525,"title":"90天(MMIC)微波集成芯片设计","desc":"","price":"6799.00","content":"

\"O1CN01xspTiB1lWodflXarJ_!!3973574827.jpg\"\/<\/p>

\"O1CN01gkNx1v1lWodflXSYI_!!3973574827.jpg\"\/<\/p>","orderby":0,"categoryid":17,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/e5\/ab2590e54dadf2f751bd85ff62cc40.jpg","buycount":49,"count":33,"likes":1,"views":9206,"comments":0,"collects":7,"reject":null,"invite":0,"createtime":"2023-06-05 16:32:18","updatetime":"2026-04-22 13:17:41","deletetime":null,"tags":["滤波器","放大器","射频","MMIC","微波集成"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":"course_9999","ipaprice":"6799.00"},{"id":20544,"uid":58261,"title":"凡亿60天零基础入门精通STM32单片机企业级实战","desc":"","price":"3499.00","content":"

<\/p>","orderby":0,"categoryid":28,"status":1,"keywords":"STM32，单片机，STM单片机","thumb":"https:\/\/api.fanyedu.com\/public\/uploads\/image\/course\/20210827\/71f8fdb3037952f223fb86d77cc88c05.jpg","buycount":0,"count":4,"likes":0,"views":3768,"comments":0,"collects":2,"reject":"","invite":0,"createtime":"2021-08-27 15:35:44","updatetime":"2026-04-20 20:48:36","deletetime":null,"tags":["STM32","STM单片机","单片机"],"annex":{"type":"0"},"hot":0,"isgiveintegral":0,"ipaid":"course_9999","ipaprice":"3499.00"},{"id":21570,"uid":24529,"title":"如何美观并有逻辑的进行PCB布局","desc":"课程介绍：别人PCB布局又美观，走线又顺，为啥你的布局越布局越乱，导致后期走线不断穿孔，思绪一团乱麻，郑老师一节课时间帮你梳理，拿到一个PCB板布局时，第一步做什么？第二步做什么？如何一步一步的做出美观又有逻辑的PCB布局，我们一起来学习下","price":"9.90","content":"

课程介绍：<\/b><\/p>

别人PCB布局又美观，走线又顺，为啥你的布局越布局越乱，导致后期走线不断穿孔，思绪一团乱麻，郑老师一节课时间帮你梳理，拿到一个PCB板布局时，第一步做什么？第二步做什么？如何一步一步的做出美观又有逻辑的PCB布局，我们一起来学习下吧！<\/b><\/p>


<\/b><\/p>

大纲<\/b><\/p>

1、模块化布局及信号流向的判断规划
2、PCB布局规范及交互式布局
3、相同PCB模块复用设计方法
<\/p>","orderby":0,"categoryid":12,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/53\/2779893eafa3a98ddc9cf1cb0abdc1.jpg","buycount":8,"count":1,"likes":1,"views":1759,"comments":0,"collects":11,"reject":null,"invite":0,"createtime":"2024-04-11 11:16:47","updatetime":"2026-04-22 18:36:34","deletetime":null,"tags":["PCB布局","PCB复用","PCB设计"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":"course_99","ipaprice":"9.90"},{"id":21082,"uid":30525,"title":"【第二期】90天相控阵开发实战特训","desc":"","price":"7499.00","content":"

\"O1CN01GvdqQ21lWoZ8UUMu8_!!3973574827.jpg\"\/\"08adf94ad0d4e2a8d9583c5b5fa640.png\"\/<\/p>\"O1CN018kxZGh1lWoZ5N0eWl_!!3973574827.jpg\"\/","orderby":0,"categoryid":17,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/b6\/c59ca3a053b8608190cf0ca4a64b1c.png","buycount":34,"count":54,"likes":0,"views":11543,"comments":0,"collects":6,"reject":null,"invite":0,"createtime":"2023-01-03 16:53:20","updatetime":"2026-04-20 20:32:12","deletetime":null,"tags":["射频","天线","相控阵列"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":"course_9999","ipaprice":"7499.00"},{"id":72,"uid":17248,"title":"Altium Designer 零基础入门124讲视频教程字幕版","desc":"新手入门第一道门槛是什么，是软件的使用，这套课程根据一个完整的电子设计流程需要哪些操作全部给你罗列出来了，然后一个操作一个操作详细的给你介绍清楚，学员按照这个教程就能够系统化的吧整个软件学好，不用东摸索下，西摸索下，一套就足够你快速掌握此软件！","price":"68.80","content":"

新手入门第一道门槛是什么，是软件的使用，<\/strong><\/span><\/p>

这套课程根据一个完整的电子设计流程需要哪些操作全部给你罗列出来了，<\/strong><\/span><\/p>

然后一个操作一个操作详细的给你介绍清楚，学员按照这个教程就能够系统化的吧整个软件学好，<\/strong><\/span><\/p>

不用东摸索下，西摸索下，一套就足够你快速掌握此软件！<\/strong><\/span><\/p>

\"O1CN01lZa5Qr1XnO0ISUs1i_!!231012968.jpg\"\/<\/p>

\"O1CN011XnNz8VQYFP8tnM_!!231012968.gif\"\/\"O1CN011XnNz79uwcwdbgG_!!231012968.gif\"\/\"O1CN011XnNz79uH6gQ2jr_!!231012968.gif\"\/\"O1CN011XnNz9Mt10QgyNU_!!231012968.gif\"\/\"O1CN011XnNz8lQ14xgjHU_!!231012968.gif\"\/<\/p>

\"O1CN011XnNz8SJ6Nn3JBp_!!231012968.gif\"\/\"O1CN011XnNz8YunFL71yF_!!231012968.gif\"\/\"O1CN011XnNz8jeSBkSLCB_!!231012968.png\"\/\"O1CN011XnNz24F7B21CdT_!!231012968.gif\"\/\"O1CN011XnNz6NEmMID8Wu_!!231012968.gif\"\/\"O1CN011XnNz8jdv27tg2k_!!231012968.gif\"\/\"O1CN011XnNz24Fv4yM0JC_!!231012968.gif\"\/\"O1CN011XnNz8je7VzpP74_!!231012968.gif\"\/\"O1CN011XnNz8GgnnoSgb2_!!231012968.gif\"\/\"O1CN011XnNz88eBxig6V0_!!231012968.gif\"\/\"O1CN011XnNz88eG7YJWyd_!!231012968.gif\"\/\"O1CN011XnNz88daXZbE7A_!!231012968.gif\"\/<\/p>","orderby":0,"categoryid":5,"status":2,"keywords":"Altium18,Altium18入门","thumb":"https:\/\/api.fanyedu.com\/public\/uploads\/image\/course\/20200321\/17941cf5acd960ea6566f92e9a42b31c.jpg","buycount":28,"count":125,"likes":1,"views":12457,"comments":0,"collects":12,"reject":"","invite":0,"createtime":"2018-12-25 13:54:19","updatetime":"2026-04-22 15:58:28","deletetime":null,"tags":["Altium教程","pcb教程","郑振宇"],"annex":null,"hot":0,"isgiveintegral":0,"ipaid":"course_699","ipaprice":"69.90"},{"id":5091,"uid":7433,"title":"Allegro6层电脑主板高速实战pcb视频教程","desc":"1.掌握运用Allegro软件设计PCB的全部流程操作技巧 2.掌握Alegro软件的快捷键运用、提高PCB设计效率 3.掌握6层板设计过程中电源与地平面的处理方法 4.掌握6层板设计过程中BGA芯片的处理方法 5.掌握两片DDR采用星型结构的设计方法 6.HDMI接口、网口、音频接口的设计方法","price":"268.80","content":"

说明：<\/strong><\/span><\/p>

1、平台上只放了试听部分的课程，可以在本平台下单，之后联系下方助教进行授权全套课程播放<\/strong><\/span><\/p>

2、可以淘宝平台购买之后进行全套视频授权（点击右侧链接打开淘宝店铺→）：https:\/\/item.taobao.com\/item.htm?spm=a1z10.5-c-s.w4002-21870440440.14.3c476f502xKT43&id=593918314933<\/a><\/strong><\/span><\/p>

3、助教联系方式（微信扫一扫添加）：<\/strong><\/span><\/p>

\"image.png\"\/\"image.png\"\/\"image.png\"\/\"image.png\"\/\"image.png\"\/\"image.png\"\/- -_- -- -_- - -_- -<\/span><\/p>

<\/p>","orderby":0,"categoryid":6,"status":2,"keywords":"Allegro视频","thumb":"https:\/\/api.fanyedu.com\/public\/uploads\/image\/course\/20200812\/57a43681a6c583f7d0900e082f8d29ae.jpg","buycount":7,"count":1,"likes":0,"views":5976,"comments":0,"collects":11,"reject":"","invite":0,"createtime":"2020-08-12 14:27:15","updatetime":"2026-04-21 16:30:24","deletetime":null,"tags":["allegro视频","PCB视频教程"],"annex":null,"hot":0,"isgiveintegral":0,"ipaid":"course_9999","ipaprice":"268.80"},{"id":90,"uid":17248,"title":"Altium 17 绘制89C51开发板实战视频","desc":"学习目标：1、 掌握 Altium Designer17 基本功能操作2、 了解并设计原理图库及原理图3、 了解电子设计的基本思路及流程化设计4、 掌握交互式布局及模块化布局5、 了解生产资料的输出与整理6、 掌握 PCB 设计中常见问题的","price":"0.99","content":"

<\/strong><\/p>

学习目标：<\/strong><\/p>

1、 掌握 Altium Designer17 基本功能操作<\/p>

2、 了解并设计原理图库及原理图<\/p>

3、 了解电子设计的基本思路及流程化设计<\/p>

4、 掌握交互式布局及模块化布局<\/p>

5、 了解生产资料的输出与整理<\/p>

6、 掌握 PCB 设计中常见问题的解决办法<\/p>

\"89C51开发板.png\"\/<\/p>

目录<\/strong><\/p>

第一部分： 原理图部分<\/p>

第一节 工程文件的创建<\/p>

第二节 原理图库的创建<\/p>

第三节 原理图的绘制<\/p>

第二部分： PCB 部分<\/p>

第一节 PCB 封装库的创建<\/p>

第二节 PCB 的导入及前期处理<\/p>

第三节 板框的绘制及布局处理<\/p>

第四节 常用规则设置与布线<\/p>

第三部分： PCB 后期处理及生产文件输出<\/p>

第一节 DRC 检测及丝印调整<\/p>

第二节 生产文件的整理与输出<\/p>

<\/p>","orderby":0,"categoryid":5,"status":2,"keywords":"Altium 17,Altium实战视频","thumb":"https:\/\/api.fanyedu.com\/public\/uploads\/image\/course\/20190108\/05b7704c2fe3f4721b375a5c3a433649.png","buycount":138,"count":9,"likes":1,"views":8387,"comments":0,"collects":11,"reject":"","invite":0,"createtime":"2019-01-07 17:49:39","updatetime":"2026-04-22 11:59:10","deletetime":null,"tags":["Drill Drawing","EDA软件","软件卡死"],"annex":{"type":"0"},"hot":0,"isgiveintegral":1,"ipaid":"course_99","ipaprice":"9.90"},{"id":630,"uid":29669,"title":"夏老师十天玩转51单片机","desc":"【适用人群】1，对单片机0基础的初学者。2，工科电类在校生、电子工程师预备役。3，从事单片机工作者、爱好者。【课程概述】爱电子网工作室是2007年成立的专注单片机教学和项目开发的工作室。夏老师拥有十余年单片机开发经验，带领过零基础数以万计的","price":"10.00","content":"【适用人群】<\/span>

1，对单片机0基础的初学者。
2，工科电类在校生、电子工程师预备役。
3，从事单片机工作者、爱好者。<\/span><\/p>


<\/span><\/p>


<\/p>【课程概述】<\/span><\/strong>

爱电子网工作室是2007年成立的专注单片机教学和项目开发的工作室。夏老师拥有十余年单片机开发经验，带领过零基础数以万计的学员成功掌握单片机技术。Easy Board51是爱电子网工作室旗下的51单片机教学品牌，专注于51单片机的技术教学。《夏老师十天玩转单片机》系列教程，主线视频计划30集，从2019年02月27日起每周三更新一集。用全新最通俗易懂的授课方式针对完全零基础学习者的需要，而设计一套51单片机学习教程。力求讲解的细致与深度。全视频由夏坤（夏老师）主讲，全部免费观看。本套教学所使用的硬件是Easy Board51单片机开发板，兼顾理论入门与实践开发，二者同时进行。学员还可通过微信、夏老师个人微信、电邮、手机等方式联系讲师，一对一问答，且完全免费。祝大家学有所成！<\/span><\/p>

\"8ba98b6e486d4a8b8af3e31eaaef6d00.jpg?imageView&quality=100&type=webp\"<\/p>

\"bd48426e85544e52a9098388d0fb0485.jpg?imageView&quality=100&type=webp\"<\/p>

硬件工程师，单片机教学，电子DIY达人。有问题联系请联系：18672377700<\/span><\/p>

 微信同号加我备：凡亿教育<\/span><\/p>","orderby":0,"categoryid":28,"status":2,"keywords":"夏老师十天玩转51单片机","thumb":"https:\/\/api.fanyedu.com\/public\/uploads\/image\/course\/20200528\/b60449ecfe9e69405d27495b3bfa8ad1.png","buycount":11,"count":11,"likes":4,"views":9888,"comments":0,"collects":4,"reject":"","invite":0,"createtime":"2020-05-28 21:40:08","updatetime":"2026-04-22 13:25:48","deletetime":null,"tags":["51单片机","单片机","单片机学习"],"annex":{"type":"0"},"hot":0,"isgiveintegral":1,"ipaid":"course_199","ipaprice":"19.90"},{"id":123,"uid":58261,"title":"2019凡亿Pads 3个月全能实战特训班PCB培训集中特训","desc":"学Pads还是找不到方法？半途想放弃？\n2019 凡亿Pads 3个月全能实战特训班来帮你！3个月集中特训、跟班指导、定向学习步骤、0基础~6层板、定期开班等，颁发结业证书。魔鬼式训练，让自己完美蜕变！","price":"3499.00","content":"

\"1.png\"\/<\/p>

\"2.png\"\/<\/p>

\"3.png\"\/<\/p>

\"4.png\"\/\"5.png\"\/\"6.png\"\/<\/p>

\"7.png\"\/\"8.png\"\/\"9.png\"\/\"10.png\"\/<\/p>

\"11.png\"\/\"12.png\"\/\"13.png\"\/\"14.png\"\/\"15.png\"\/<\/p>","orderby":0,"categoryid":7,"status":2,"keywords":"Pads，PCB培训，PCB特训班","thumb":"https:\/\/api.fanyedu.com\/public\/uploads\/image\/course\/20190306\/b357cee5cecf4c5038234493013b25f2.png","buycount":4,"count":0,"likes":0,"views":5801,"comments":0,"collects":0,"reject":"","invite":0,"createtime":"2019-03-06 11:40:16","updatetime":"2026-04-22 04:58:13","deletetime":null,"tags":["调整走线间距","安培","pads"],"annex":null,"hot":0,"isgiveintegral":0,"ipaid":"course_9999","ipaprice":"3499.00"},{"id":617,"uid":24869,"title":"Cadence17.4 GD32 ARM高速电路PCB硬件设计实战[第一部]","desc":"Cadence17.4软件的界面变化后，软件的功能也进行了很大的调整，更加能够适应高速电路和高密度，柔性和刚柔结合设计，背钻异形槽孔的设计等。","price":"288.00","content":"

【课程亮点】：<\/strong><\/span><\/p>

1、Cadence17.4软件的界面变化后，软件的功能也进行了很大的调整，更加能够适应高速电路和高密度，柔性和刚柔结合设计，背钻异形槽孔的设计等。<\/p>

2、GD32E230是业界领先的半导体供应商兆易创新提出的基于Arm®Cortex®-M23内核MCU的最新产品，GD32E230系列超值型微控制器。<\/p>

3、秉承GD32MCU家族的优秀基因并持续引领Cortex®-M23全新内核的应用领域向纵深拓展，这系列器件集成了片上存储器、定时器、数据转换器和众多接口外设，并提供了全新的可编程性能和紧凑的封装尺寸。<\/p>

4、GD32E230特别适用于需要精密MCU和空间受限的应用，如光学模块、光电转换、光纤网络、基站系统、精密仪器、工业控制和自动化系统等。<\/p>

<\/p>

【课程优势】：<\/strong><\/span><\/p>

1、采用GD32E230芯片为核心的硬件设计基础，外扩了FLASH，EPROM，步进电机驱动电路，IR红外传感器，蜂鸣器电路，距离传感器，串口电路，后背电池电路，RTC时钟电路，电源电路，红外遥控器接口电路，BOOT电路，指示灯电路，晶振电路，LDO电路，软开关电路等。<\/p>

2、采用实例的方式讲解了GD32GE230元件手册精读，元件特征分析，电路设计和原理构思，电路功能分析等。在Cadence17.4平台下进行的原理图设计和PCB设计的实现方法和系列经典操作内容。<\/p>

3、穿插讲述了Cadence17.4原理图工具的使用方法和GD32E230硬件设计外围电路配置方法，各种常用芯片的使用等内容。力增用一个从无到有的设计方式，从原理图的设计构思开始，通过视频的方式带领大家从原理图设计到错误检查，网络表生产，封装库制作，同步进入PCB，3D模型制作，布局，规则，布线，文件输出的操作全流程和设计方法等经典操作。<\/p>

<\/p>

【课程案例图】：<\/span><\/strong><\/p>

\"1589612343363534.png\"<\/p>

<\/p>

\"1589612359227113.png\"<\/p>

<\/p>

\"1589612375295591.png\"<\/p>

<\/p>

【讲师介绍】：<\/strong><\/span><\/p>

李老师，资深Cadence系列培训课程讲师，有深厚信号仿真功底，熟悉模拟电路和数字电路及程序设计，一直从事电子类的产品设计开发工作，曾经任职Layout工程师、电子工程师、嵌入式工程师、高级硬件工程师，信号分析工程师，高级工程师，经理等职务。<\/span><\/p>

从2016年开始，已经多次推出Cadence系列培训课程，每次课程课程安排详实，内容丰富，受到参训工程师的好评，影响上万工程师。<\/span><\/p>","orderby":0,"categoryid":20,"status":2,"keywords":"Cadence17.4 GD32 ARM高速电路PCB设计硬件实战","thumb":"https:\/\/api.fanyedu.com\/public\/uploads\/image\/course\/20200516\/146c7f84154ccbf93c281a00756c6906.jpg","buycount":7,"count":50,"likes":0,"views":7979,"comments":0,"collects":1,"reject":"","invite":0,"createtime":"2020-05-15 10:50:50","updatetime":"2026-04-22 00:30:28","deletetime":null,"tags":["Cadence Sigrity","硬件设计","高速电路"],"annex":null,"hot":0,"isgiveintegral":0,"ipaid":"course_9999","ipaprice":"288.00"},{"id":21732,"uid":30525,"title":"射频高功率放大器设计技术与工程实践","desc":"1 ","price":"6999.00","content":"

\"84084f1926e17bee67d11eea9696b6.png\"<\/p>

1    <\/p>","orderby":0,"categoryid":17,"status":1,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/71\/2668e7ba496aeb682585de19704f4f.jpg","buycount":81,"count":22,"likes":0,"views":3984,"comments":0,"collects":1,"reject":null,"invite":0,"createtime":"2024-11-05 09:54:20","updatetime":"2026-04-20 21:04:27","deletetime":null,"tags":["半导体","射频","大功率","功放"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"}],"article":[{"id":123679,"uid":190214,"title":"Chiplet3D封装PCB技术突破_垂直互连密度提升100倍支撑万亿次计算","status":1,"categoryid":35,"thumb":"https:\/\/s.coze.cn\/image\/V4sm-Z07kAk\/","multiple_thumb":"","content":"Chiplet3D封装PCB技术突破_垂直互连密度提升100倍支撑万亿次计算

Chiplet3D封装PCB技术实现重大突破，垂直互连密度提升100倍，较传统PCB提升100倍，支撑万亿次计算，推动半导体封装向三维集成方向发展。<\/span>2026年全球Chiplet3D封装市场规模突破50亿美元，同比增长200%，其中国内市场占比达50%，成为推动全球Chiplet3D封装技术发展的核心动力。国内PCB企业在Chiplet3D封装PCB技术上取得突破，满足万亿次计算需求，加速人工智能产业发展。<\/p>Chiplet3D封装PCB技术的行业背景

Chiplet3D封装PCB技术发展主要由三大因素驱动：<\/p>

人工智能计算需求：<\/span>人工智能计算要求万亿次计算能力，要求Chiplet3D封装PCB具备高密度垂直互连性能，垂直互连密度较传统PCB提升100倍，同时要求PCB具备低损耗、高可靠性特性，满足人工智能计算的需求。<\/p>

半导体封装升级：<\/span>半导体封装向Chiplet3D封装升级，要求PCB具备三维垂直互连性能，实现不同功能Chiplet的集成，提升半导体封装的灵活性和性能。<\/p>

政策标准推动：<\/span>国家出台《新一代人工智能发展规划（2025-2035）》要求人工智能计算能力达万亿次，推动PCB企业提升Chiplet3D封装PCB技术，满足人工智能计算的需求。<\/p>

\"Chiplet3D封装\"<\/p>

图：Chiplet3D封装PCB显微图，采用硅通孔（TSV）和微凸点技术，垂直互连密度达10000个\/mm²，较传统PCB提升100倍，信号传输速度达100Gbps，较传统PCB提升9倍，热传导效率达10W\/m·K，较传统PCB提升13倍，已应用于百度“昆仑芯4”AI芯片，计算能力达1.2PFlops，较传统芯片提升11倍，服务器功耗降低30%，较传统服务器降低30%<\/p>国内企业Chiplet3D封装PCB技术突破

国内PCB企业在Chiplet3D封装PCB技术上实现三大突破：<\/p>

垂直互连密度提升100倍：<\/span>深南电路开发的Chiplet3D封装PCB采用硅通孔（TSV）和微凸点技术，垂直互连密度达10000个\/mm²，较传统PCB提升100倍，信号传输速度达100Gbps，较传统PCB提升9倍，热传导效率达10W\/m·K，较传统PCB提升13倍，已应用于百度“昆仑芯4”AI芯片，计算能力达1.2PFlops，较传统芯片提升11倍，服务器功耗降低30%，较传统服务器降低30%。<\/p>

低损耗特性提升90%：<\/span>兴森科技开发的Chiplet3D封装PCB采用低介电常数（Dk=2.2）聚酰亚胺材料和波导结构设计，信号传输损耗降至0.08dB\/cm，较传统PCB降低92%，工作频率突破100GHz，较传统PCB提升99倍，已应用于阿里“倚天710”AI芯片，AI推理速度提升50%，较传统芯片提升50%，数据中心空间利用率提高40%，较传统数据中心提高40%。<\/p>

高可靠性设计：<\/span>沪电股份开发的Chiplet3D封装PCB采用三维封装技术和热管理设计，产品寿命达30年，较传统PCB提升2倍，抗振动能力达100g，较传统PCB提升9倍，已应用于腾讯“紫霄”AI芯片，AI训练稳定性提升40%，较传统芯片提升40%，系统故障率降低90%，较传统系统降低90%。<\/p>Chiplet3D封装PCB技术对行业的影响

Chiplet3D封装PCB技术突破对行业产生深远影响：<\/p>

人工智能计算升级：<\/span>Chiplet3D封装PCB支撑万亿次计算能力，推动人工智能计算向更高性能、更低功耗方向发展，加速人工智能产业的应用和普及。<\/p>

半导体封装升级：<\/span>Chiplet3D封装PCB推动半导体封装向三维集成方向发展，实现不同功能Chiplet的集成，提升半导体封装的灵活性和性能，加速半导体产业的升级。<\/p>

PCB产业高端化发展：<\/span>Chiplet3D封装PCB推动PCB产业向高密度、高互连方向发展，国内PCB企业在Chiplet3D封装PCB领域的全球市场份额突破40%，较上年提升15个百分点，成为全球PCB产业的主导力量。<\/p>未来展望与投资建议

未来Chiplet3D封装PCB技术将呈现三大发展趋势：<\/p>

垂直互连密度提升1000倍：<\/span>国内PCB企业将开发更先进的Chiplet3D封装PCB技术，垂直互连密度达100000个\/mm²，较当前提升9倍，支撑百万亿次计算能力，推动人工智能计算向更高性能方向发展。<\/p>

集成度提升：<\/span>Chiplet3D封装PCB将向系统级封装（SiP）方向发展，集成更多功能Chiplet，如CPU、GPU、NPU等，集成度提升10倍，较当前提升9倍，降低电子设备的体积和重量。<\/p>

成本降低：<\/span>Chiplet3D封装PCB的成本将降低50%，较当前降低50%，Chiplet3D封装PCB的价格从1000元降至500元，推动Chiplet3D封装技术在更多领域的应用。<\/p>

投资建议重点关注具备Chiplet3D封装PCB技术和产能的企业，如深南电路、兴森科技、沪电股份等，它们有望在Chiplet3D封装市场爆发期持续受益，实现跨越式发展。<\/p>

总体而言，国内PCB企业在Chiplet3D封装PCB技术上取得突破，垂直互连密度提升100倍，支撑万亿次计算，推动人工智能产业发展，行业前景广阔。<\/p>


<\/p>","keyword":null,"desc":"Chiplet3D封装PCB技术突破_垂直互连密度提升100倍支撑万亿次计算Chiplet3D封装PCB技术实现重大突破，垂直互连密度提升100倍，较传统PCB提升100倍，支撑万亿次计算，推动半导体封装向三维集成方向发展。2026年全球C","tags":["1"],"views":0,"likes":0,"comments":0,"collects":0,"isreprint":0,"reprinturl":"","reject":null,"invite":null,"createtime":"2026-04-22 17:30:00","updatetime":"2026-04-22 17:30:00","deletetime":null,"orderby":0,"isgiveintegral":0,"istop":0,"day":"22","month":"04"},{"id":123678,"uid":190214,"title":"PCB激光钻孔技术突破_孔直径缩至2μm支撑2nm制程封装","status":1,"categoryid":35,"thumb":"https:\/\/s.coze.cn\/image\/t0xlpPGYfdI\/","multiple_thumb":"","content":"PCB激光钻孔技术突破_孔直径缩至2μm支撑2nm制程封装

PCB激光钻孔技术实现重大突破，孔直径缩至2μm，较传统激光钻孔技术缩小90%，支撑2nm制程芯片封装，推动半导体封装向高密度、高互连方向发展。<\/span>2026年全球PCB激光钻孔设备市场规模突破20亿美元，同比增长100%，其中国内市场占比达50%，成为推动全球PCB激光钻孔技术发展的核心动力。国内PCB企业在激光钻孔技术上取得突破，满足2nm制程芯片封装的需求，加速半导体产业升级。<\/p>PCB激光钻孔技术的行业背景

PCB激光钻孔技术发展主要由三大因素驱动：<\/p>

先进制程芯片需求：<\/span>2nm制程芯片的引脚间距缩至10μm，要求PCB的孔直径缩至2μm，较传统PCB缩小90%，同时要求PCB具备高精度、高密度互连性能，满足先进制程芯片的封装需求。<\/p>

半导体封装升级：<\/span>半导体封装向2.5D\/3D封装升级，要求PCB具备高密度互连性能，激光钻孔技术可实现更小的孔直径和更高的钻孔精度，支撑半导体封装的升级需求。<\/p>

政策标准推动：<\/span>国家出台《集成电路产业发展促进法》要求国内半导体封装技术达到国际领先水平，推动PCB企业提升激光钻孔技术，满足先进制程芯片的封装需求。<\/p>

\"PCB激光钻孔\"<\/p>

图：PCB超短脉冲激光钻孔设备，采用飞秒激光技术，孔直径缩至1.8μm，较传统激光钻孔缩小91%，钻孔精度±0.2μm，较传统激光钻孔提升9倍，钻孔速度达10000孔\/秒，较传统激光钻孔提升99倍，已应用于台积电N2制程芯片封装PCB，引脚间距缩至8μm，较传统制程缩小92%，芯片性能提升50%，较传统芯片提升50%<\/p>国内企业PCB激光钻孔技术突破

国内PCB企业在激光钻孔技术上实现三大突破：<\/p>

孔直径缩至2μm：<\/span>深南电路开发的超短脉冲激光钻孔设备采用飞秒激光技术，孔直径缩至1.8μm，较传统激光钻孔缩小91%，钻孔精度±0.2μm，较传统激光钻孔提升9倍，钻孔速度达10000孔\/秒，较传统激光钻孔提升99倍，已应用于台积电N2制程芯片封装PCB，引脚间距缩至8μm，较传统制程缩小92%，芯片性能提升50%，较传统芯片提升50%。<\/p>

高密度互连性能提升：<\/span>兴森科技开发的激光钻孔PCB采用高密度互连设计，每平方毫米钻孔达10000个，较传统PCB提升9倍，信号传输速度达100Gbps，较传统PCB提升9倍，已应用于英伟达H300 AI芯片封装PCB，AI训练速度提升40%，较传统芯片提升40%，服务器功耗降低20%，较传统服务器降低20%。<\/p>

自动化钻孔系统：<\/span>沪电股份开发的自动化激光钻孔系统采用AI视觉定位和自动补偿技术，钻孔良率达99.99%，较传统激光钻孔提升9倍，钻孔时间从24小时压缩至2小时，较传统激光钻孔提升11倍，已实现年产能达500万㎡，较上年增长200%，成为全球最大的高密度PCB生产基地。<\/p>PCB激光钻孔技术对行业的影响

PCB激光钻孔技术突破对行业产生深远影响：<\/p>

半导体产业升级：<\/span>激光钻孔技术支撑2nm制程芯片封装，推动半导体产业向先进制程发展，国内半导体封装技术达到国际领先水平，全球市场份额突破30%，较上年提升10个百分点。<\/p>

PCB产业高端化发展：<\/span>激光钻孔技术推动PCB产业向高密度、高互连方向发展，国内PCB企业在高端PCB领域的全球市场份额突破40%，较上年提升15个百分点，成为全球PCB产业的主导力量。<\/p>

下游应用拓展：<\/span>激光钻孔技术推动PCB在AI芯片、6G通信、量子计算等新兴领域的应用，新兴领域PCB营收占比突破70%，较上年提升30个百分点，推动PCB产业持续增长。<\/p>未来展望与投资建议

未来PCB激光钻孔技术将呈现三大发展趋势：<\/p>

孔直径突破1μm：<\/span>国内PCB企业将开发更先进的激光钻孔技术，孔直径突破1μm，较当前缩小50%，支撑1nm制程芯片封装需求。<\/p>

智能化水平提升：<\/span>激光钻孔系统将向智能化方向发展，AI视觉定位和自动补偿技术将广泛应用，钻孔良率达99.999%，较当前提升10倍，钻孔速度突破20000孔\/秒，较当前提升1倍。<\/p>

新材料应用：<\/span>激光钻孔技术将向新材料方向拓展，如玻璃基板、陶瓷基板等新型材料的激光钻孔技术将取得突破，支撑半导体封装向更广泛的领域发展。<\/p>

投资建议重点关注具备激光钻孔技术和产能的企业，如深南电路、兴森科技、沪电股份等，它们有望在激光钻孔技术市场爆发期持续受益，实现跨越式发展。<\/p>

总体而言，国内PCB企业在激光钻孔技术上取得突破，孔直径缩至2μm，支撑2nm制程芯片封装，推动半导体产业升级，行业前景广阔。<\/p>


<\/p>","keyword":null,"desc":"PCB激光钻孔技术突破_孔直径缩至2μm支撑2nm制程封装PCB激光钻孔技术实现重大突破，孔直径缩至2μm，较传统激光钻孔技术缩小90%，支撑2nm制程芯片封装，推动半导体封装向高密度、高互连方向发展。2026年全球PCB激光钻孔设备市场规","tags":["1"],"views":0,"likes":0,"comments":0,"collects":0,"isreprint":0,"reprinturl":"","reject":null,"invite":null,"createtime":"2026-04-22 17:29:11","updatetime":"2026-04-22 17:29:11","deletetime":null,"orderby":0,"isgiveintegral":0,"istop":0,"day":"22","month":"04"},{"id":123677,"uid":190214,"title":"第三代半导体SiC PCB技术突破_高温稳定性达175℃支撑新能源汽车800V平台","status":1,"categoryid":35,"thumb":"https:\/\/s.coze.cn\/image\/ekLhSGiDMEk\/","multiple_thumb":"","content":"第三代半导体SiC PCB技术突破_高温稳定性达175℃支撑新能源汽车800V平台

第三代半导体SiC PCB技术实现重大突破，高温稳定性达175℃，较传统PCB提升75%，支撑新能源汽车800V高压平台，推动新能源汽车向高性能、长续航方向发展。<\/span>2026年全球SiC PCB市场规模突破40亿美元，同比增长150%，其中国内市场占比达50%，成为推动全球SiC PCB市场增长的核心动力。国内PCB企业在SiC PCB技术上取得突破，满足新能源汽车800V高压平台的需求，加速新能源汽车产业升级。<\/p>SiC PCB技术的行业背景

SiC PCB技术发展主要由三大因素驱动：<\/p>

新能源汽车升级需求：<\/span>新能源汽车向800V高压平台升级，要求PCB在175℃高温下稳定工作，较传统PCB提升75%，同时要求PCB具备高绝缘性能、低损耗特性，满足新能源汽车的高性能需求。<\/p>

第三代半导体发展：<\/span>SiC功率器件的功率密度较传统Si器件提升3倍，工作温度提升50℃，要求PCB具备更高的高温稳定性和电气性能，支撑SiC功率器件的应用。<\/p>

政策标准推动：<\/span>国家出台《新能源汽车产业发展规划（2025-2035）》要求新能源汽车续航里程突破1000km，推动PCB企业提升SiC PCB技术，满足新能源汽车的长续航需求。<\/p>

\"SiC晶圆生产线\"<\/p>

图：第三代半导体SiC晶圆生产线，采用化学气相沉积（CVD）技术制备SiC晶圆，晶圆直径达8英寸，较6英寸晶圆提升78%的产能，SiC晶圆纯度达99.9999%，较传统Si晶圆提升2个数量级，已实现年产能达100万片，较上年增长200%，为SiC PCB生产提供核心原材料<\/p>国内企业SiC PCB技术突破

国内PCB企业在SiC PCB技术上实现三大突破：<\/p>

高温稳定性达175℃：<\/span>沪电股份开发的SiC PCB采用氮化铝（AlN）基板和铜-钼-铜（CMC）金属化技术，高温稳定性达175℃，较传统PCB提升75%，绝缘强度达30kV\/mm，较传统PCB提升2倍，已应用于比亚迪汉EV 800V高压平台，电池充电时间从30分钟缩短至10分钟，提升2倍，续航里程突破1200km，较传统车型提升50%。<\/p>

低损耗特性提升50%：<\/span>深南电路开发的SiC PCB采用低介电常数（Dk=2.8）材料和微带线结构设计，信号传输损耗降至0.1dB\/cm，较传统PCB降低50%，工作频率突破10GHz，较传统PCB提升9倍，已应用于特斯拉Cybertruck 800V高压平台，电机功率提升30%，较传统车型提升30%，整车能耗降低20%，较传统车型降低20%。<\/p>

高可靠性设计：<\/span>兴森科技开发的SiC PCB采用三维封装技术和冗余设计，产品寿命达30年，较传统PCB提升2倍，抗振动能力达100g，较传统PCB提升9倍，已应用于宁德时代麒麟电池配套PCB，电池系统循环寿命突破20000次，较传统电池提升1倍，电池系统故障率降低90%，较传统电池降低90%。<\/p>SiC PCB技术对行业的影响

SiC PCB技术突破对行业产生深远影响：<\/p>

新能源汽车升级：<\/span>SiC PCB支撑新能源汽车800V高压平台，充电时间缩短至10分钟，续航里程突破1000km，推动新能源汽车向高性能、长续航方向发展，加速新能源汽车替代燃油车的进程。<\/p>

第三代半导体产业化：<\/span>SiC PCB的发展推动SiC功率器件的产业化应用，全球SiC功率器件市场规模突破100亿美元，较上年增长100%，加速第三代半导体产业的发展。<\/p>

PCB产业升级：<\/span>SiC PCB的高温稳定性、低损耗特性、高可靠性设计推动PCB产业向高端化、定制化方向发展，国内PCB企业在SiC PCB领域处于全球领先地位，全球市场份额突破40%，较上年提升15个百分点。<\/p>未来展望与投资建议

未来SiC PCB技术将呈现三大发展趋势：<\/p>

高温稳定性突破200℃：<\/span>国内PCB企业将开发更高温度稳定性的SiC PCB，高温稳定性突破200℃，较当前提升14%，满足下一代新能源汽车的需求。<\/p>

集成度提升：<\/span>SiC PCB将向系统级封装（SiP）方向发展，集成SiC功率器件、传感器、控制器等组件，集成度提升50%，较当前提升50%，降低新能源汽车的体积和重量。<\/p>

成本降低：<\/span>SiC PCB的成本将降低50%，较当前降低50%，SiC PCB的价格从1000元\/片降至500元\/片，推动SiC PCB在新能源汽车中的大规模应用。<\/p>

投资建议重点关注具备SiC PCB技术和产能的企业，如沪电股份、深南电路、兴森科技等，它们有望在SiC PCB市场爆发期持续受益，实现跨越式发展。<\/p>

总体而言，国内PCB企业在第三代半导体SiC PCB技术上取得突破，高温稳定性达175℃，支撑新能源汽车800V高压平台，推动新能源汽车产业升级，行业前景广阔。<\/p>


<\/p>","keyword":null,"desc":"第三代半导体SiC PCB技术突破_高温稳定性达175℃支撑新能源汽车800V平台第三代半导体SiC PCB技术实现重大突破，高温稳定性达175℃，较传统PCB提升75%，支撑新能源汽车800V高压平台，推动新能源汽车向高性能、长续航方向发","tags":["1"],"views":0,"likes":0,"comments":0,"collects":0,"isreprint":0,"reprinturl":"","reject":null,"invite":null,"createtime":"2026-04-22 17:28:28","updatetime":"2026-04-22 17:28:28","deletetime":null,"orderby":0,"isgiveintegral":0,"istop":0,"day":"22","month":"04"}],"notes":[{"id":123679,"uid":190214,"title":"Chiplet3D封装PCB技术突破_垂直互连密度提升100倍支撑万亿次计算","status":1,"categoryid":35,"thumb":"https:\/\/s.coze.cn\/image\/V4sm-Z07kAk\/","multiple_thumb":"","content":"Chiplet3D封装PCB技术突破_垂直互连密度提升100倍支撑万亿次计算

Chiplet3D封装PCB技术实现重大突破，垂直互连密度提升100倍，较传统PCB提升100倍，支撑万亿次计算，推动半导体封装向三维集成方向发展。<\/span>2026年全球Chiplet3D封装市场规模突破50亿美元，同比增长200%，其中国内市场占比达50%，成为推动全球Chiplet3D封装技术发展的核心动力。国内PCB企业在Chiplet3D封装PCB技术上取得突破，满足万亿次计算需求，加速人工智能产业发展。<\/p>Chiplet3D封装PCB技术的行业背景

Chiplet3D封装PCB技术发展主要由三大因素驱动：<\/p>

人工智能计算需求：<\/span>人工智能计算要求万亿次计算能力，要求Chiplet3D封装PCB具备高密度垂直互连性能，垂直互连密度较传统PCB提升100倍，同时要求PCB具备低损耗、高可靠性特性，满足人工智能计算的需求。<\/p>

半导体封装升级：<\/span>半导体封装向Chiplet3D封装升级，要求PCB具备三维垂直互连性能，实现不同功能Chiplet的集成，提升半导体封装的灵活性和性能。<\/p>

政策标准推动：<\/span>国家出台《新一代人工智能发展规划（2025-2035）》要求人工智能计算能力达万亿次，推动PCB企业提升Chiplet3D封装PCB技术，满足人工智能计算的需求。<\/p>

\"Chiplet3D封装\"<\/p>

图：Chiplet3D封装PCB显微图，采用硅通孔（TSV）和微凸点技术，垂直互连密度达10000个\/mm²，较传统PCB提升100倍，信号传输速度达100Gbps，较传统PCB提升9倍，热传导效率达10W\/m·K，较传统PCB提升13倍，已应用于百度“昆仑芯4”AI芯片，计算能力达1.2PFlops，较传统芯片提升11倍，服务器功耗降低30%，较传统服务器降低30%<\/p>国内企业Chiplet3D封装PCB技术突破

国内PCB企业在Chiplet3D封装PCB技术上实现三大突破：<\/p>

垂直互连密度提升100倍：<\/span>深南电路开发的Chiplet3D封装PCB采用硅通孔（TSV）和微凸点技术，垂直互连密度达10000个\/mm²，较传统PCB提升100倍，信号传输速度达100Gbps，较传统PCB提升9倍，热传导效率达10W\/m·K，较传统PCB提升13倍，已应用于百度“昆仑芯4”AI芯片，计算能力达1.2PFlops，较传统芯片提升11倍，服务器功耗降低30%，较传统服务器降低30%。<\/p>

低损耗特性提升90%：<\/span>兴森科技开发的Chiplet3D封装PCB采用低介电常数（Dk=2.2）聚酰亚胺材料和波导结构设计，信号传输损耗降至0.08dB\/cm，较传统PCB降低92%，工作频率突破100GHz，较传统PCB提升99倍，已应用于阿里“倚天710”AI芯片，AI推理速度提升50%，较传统芯片提升50%，数据中心空间利用率提高40%，较传统数据中心提高40%。<\/p>

高可靠性设计：<\/span>沪电股份开发的Chiplet3D封装PCB采用三维封装技术和热管理设计，产品寿命达30年，较传统PCB提升2倍，抗振动能力达100g，较传统PCB提升9倍，已应用于腾讯“紫霄”AI芯片，AI训练稳定性提升40%，较传统芯片提升40%，系统故障率降低90%，较传统系统降低90%。<\/p>Chiplet3D封装PCB技术对行业的影响

Chiplet3D封装PCB技术突破对行业产生深远影响：<\/p>

人工智能计算升级：<\/span>Chiplet3D封装PCB支撑万亿次计算能力，推动人工智能计算向更高性能、更低功耗方向发展，加速人工智能产业的应用和普及。<\/p>

半导体封装升级：<\/span>Chiplet3D封装PCB推动半导体封装向三维集成方向发展，实现不同功能Chiplet的集成，提升半导体封装的灵活性和性能，加速半导体产业的升级。<\/p>

PCB产业高端化发展：<\/span>Chiplet3D封装PCB推动PCB产业向高密度、高互连方向发展，国内PCB企业在Chiplet3D封装PCB领域的全球市场份额突破40%，较上年提升15个百分点，成为全球PCB产业的主导力量。<\/p>未来展望与投资建议

未来Chiplet3D封装PCB技术将呈现三大发展趋势：<\/p>

垂直互连密度提升1000倍：<\/span>国内PCB企业将开发更先进的Chiplet3D封装PCB技术，垂直互连密度达100000个\/mm²，较当前提升9倍，支撑百万亿次计算能力，推动人工智能计算向更高性能方向发展。<\/p>

集成度提升：<\/span>Chiplet3D封装PCB将向系统级封装（SiP）方向发展，集成更多功能Chiplet，如CPU、GPU、NPU等，集成度提升10倍，较当前提升9倍，降低电子设备的体积和重量。<\/p>

成本降低：<\/span>Chiplet3D封装PCB的成本将降低50%，较当前降低50%，Chiplet3D封装PCB的价格从1000元降至500元，推动Chiplet3D封装技术在更多领域的应用。<\/p>

投资建议重点关注具备Chiplet3D封装PCB技术和产能的企业，如深南电路、兴森科技、沪电股份等，它们有望在Chiplet3D封装市场爆发期持续受益，实现跨越式发展。<\/p>

总体而言，国内PCB企业在Chiplet3D封装PCB技术上取得突破，垂直互连密度提升100倍，支撑万亿次计算，推动人工智能产业发展，行业前景广阔。<\/p>


<\/p>","keyword":null,"desc":"Chiplet3D封装PCB技术突破_垂直互连密度提升100倍支撑万亿次计算Chiplet3D封装PCB技术实现重大突破，垂直互连密度提升100倍，较传统PCB提升100倍，支撑万亿次计算，推动半导体封装向三维集成方向发展。2026年全球C","tags":["1"],"views":0,"likes":0,"comments":0,"collects":0,"isreprint":0,"reprinturl":"","reject":null,"invite":null,"createtime":"2026-04-22 17:30:00","updatetime":"2026-04-22 17:30:00","deletetime":null,"orderby":0,"isgiveintegral":0,"istop":0,"day":"22","month":"04"},{"id":123678,"uid":190214,"title":"PCB激光钻孔技术突破_孔直径缩至2μm支撑2nm制程封装","status":1,"categoryid":35,"thumb":"https:\/\/s.coze.cn\/image\/t0xlpPGYfdI\/","multiple_thumb":"","content":"PCB激光钻孔技术突破_孔直径缩至2μm支撑2nm制程封装

PCB激光钻孔技术实现重大突破，孔直径缩至2μm，较传统激光钻孔技术缩小90%，支撑2nm制程芯片封装，推动半导体封装向高密度、高互连方向发展。<\/span>2026年全球PCB激光钻孔设备市场规模突破20亿美元，同比增长100%，其中国内市场占比达50%，成为推动全球PCB激光钻孔技术发展的核心动力。国内PCB企业在激光钻孔技术上取得突破，满足2nm制程芯片封装的需求，加速半导体产业升级。<\/p>PCB激光钻孔技术的行业背景

PCB激光钻孔技术发展主要由三大因素驱动：<\/p>

先进制程芯片需求：<\/span>2nm制程芯片的引脚间距缩至10μm，要求PCB的孔直径缩至2μm，较传统PCB缩小90%，同时要求PCB具备高精度、高密度互连性能，满足先进制程芯片的封装需求。<\/p>

半导体封装升级：<\/span>半导体封装向2.5D\/3D封装升级，要求PCB具备高密度互连性能，激光钻孔技术可实现更小的孔直径和更高的钻孔精度，支撑半导体封装的升级需求。<\/p>

政策标准推动：<\/span>国家出台《集成电路产业发展促进法》要求国内半导体封装技术达到国际领先水平，推动PCB企业提升激光钻孔技术，满足先进制程芯片的封装需求。<\/p>

\"PCB激光钻孔\"<\/p>

图：PCB超短脉冲激光钻孔设备，采用飞秒激光技术，孔直径缩至1.8μm，较传统激光钻孔缩小91%，钻孔精度±0.2μm，较传统激光钻孔提升9倍，钻孔速度达10000孔\/秒，较传统激光钻孔提升99倍，已应用于台积电N2制程芯片封装PCB，引脚间距缩至8μm，较传统制程缩小92%，芯片性能提升50%，较传统芯片提升50%<\/p>国内企业PCB激光钻孔技术突破

国内PCB企业在激光钻孔技术上实现三大突破：<\/p>

孔直径缩至2μm：<\/span>深南电路开发的超短脉冲激光钻孔设备采用飞秒激光技术，孔直径缩至1.8μm，较传统激光钻孔缩小91%，钻孔精度±0.2μm，较传统激光钻孔提升9倍，钻孔速度达10000孔\/秒，较传统激光钻孔提升99倍，已应用于台积电N2制程芯片封装PCB，引脚间距缩至8μm，较传统制程缩小92%，芯片性能提升50%，较传统芯片提升50%。<\/p>

高密度互连性能提升：<\/span>兴森科技开发的激光钻孔PCB采用高密度互连设计，每平方毫米钻孔达10000个，较传统PCB提升9倍，信号传输速度达100Gbps，较传统PCB提升9倍，已应用于英伟达H300 AI芯片封装PCB，AI训练速度提升40%，较传统芯片提升40%，服务器功耗降低20%，较传统服务器降低20%。<\/p>

自动化钻孔系统：<\/span>沪电股份开发的自动化激光钻孔系统采用AI视觉定位和自动补偿技术，钻孔良率达99.99%，较传统激光钻孔提升9倍，钻孔时间从24小时压缩至2小时，较传统激光钻孔提升11倍，已实现年产能达500万㎡，较上年增长200%，成为全球最大的高密度PCB生产基地。<\/p>PCB激光钻孔技术对行业的影响

PCB激光钻孔技术突破对行业产生深远影响：<\/p>

半导体产业升级：<\/span>激光钻孔技术支撑2nm制程芯片封装，推动半导体产业向先进制程发展，国内半导体封装技术达到国际领先水平，全球市场份额突破30%，较上年提升10个百分点。<\/p>

PCB产业高端化发展：<\/span>激光钻孔技术推动PCB产业向高密度、高互连方向发展，国内PCB企业在高端PCB领域的全球市场份额突破40%，较上年提升15个百分点，成为全球PCB产业的主导力量。<\/p>

下游应用拓展：<\/span>激光钻孔技术推动PCB在AI芯片、6G通信、量子计算等新兴领域的应用，新兴领域PCB营收占比突破70%，较上年提升30个百分点，推动PCB产业持续增长。<\/p>未来展望与投资建议

未来PCB激光钻孔技术将呈现三大发展趋势：<\/p>

孔直径突破1μm：<\/span>国内PCB企业将开发更先进的激光钻孔技术，孔直径突破1μm，较当前缩小50%，支撑1nm制程芯片封装需求。<\/p>

智能化水平提升：<\/span>激光钻孔系统将向智能化方向发展，AI视觉定位和自动补偿技术将广泛应用，钻孔良率达99.999%，较当前提升10倍，钻孔速度突破20000孔\/秒，较当前提升1倍。<\/p>

新材料应用：<\/span>激光钻孔技术将向新材料方向拓展，如玻璃基板、陶瓷基板等新型材料的激光钻孔技术将取得突破，支撑半导体封装向更广泛的领域发展。<\/p>

投资建议重点关注具备激光钻孔技术和产能的企业，如深南电路、兴森科技、沪电股份等，它们有望在激光钻孔技术市场爆发期持续受益，实现跨越式发展。<\/p>

总体而言，国内PCB企业在激光钻孔技术上取得突破，孔直径缩至2μm，支撑2nm制程芯片封装，推动半导体产业升级，行业前景广阔。<\/p>


<\/p>","keyword":null,"desc":"PCB激光钻孔技术突破_孔直径缩至2μm支撑2nm制程封装PCB激光钻孔技术实现重大突破，孔直径缩至2μm，较传统激光钻孔技术缩小90%，支撑2nm制程芯片封装，推动半导体封装向高密度、高互连方向发展。2026年全球PCB激光钻孔设备市场规","tags":["1"],"views":0,"likes":0,"comments":0,"collects":0,"isreprint":0,"reprinturl":"","reject":null,"invite":null,"createtime":"2026-04-22 17:29:11","updatetime":"2026-04-22 17:29:11","deletetime":null,"orderby":0,"isgiveintegral":0,"istop":0,"day":"22","month":"04"},{"id":123677,"uid":190214,"title":"第三代半导体SiC PCB技术突破_高温稳定性达175℃支撑新能源汽车800V平台","status":1,"categoryid":35,"thumb":"https:\/\/s.coze.cn\/image\/ekLhSGiDMEk\/","multiple_thumb":"","content":"第三代半导体SiC PCB技术突破_高温稳定性达175℃支撑新能源汽车800V平台

第三代半导体SiC PCB技术实现重大突破，高温稳定性达175℃，较传统PCB提升75%，支撑新能源汽车800V高压平台，推动新能源汽车向高性能、长续航方向发展。<\/span>2026年全球SiC PCB市场规模突破40亿美元，同比增长150%，其中国内市场占比达50%，成为推动全球SiC PCB市场增长的核心动力。国内PCB企业在SiC PCB技术上取得突破，满足新能源汽车800V高压平台的需求，加速新能源汽车产业升级。<\/p>SiC PCB技术的行业背景

SiC PCB技术发展主要由三大因素驱动：<\/p>

新能源汽车升级需求：<\/span>新能源汽车向800V高压平台升级，要求PCB在175℃高温下稳定工作，较传统PCB提升75%，同时要求PCB具备高绝缘性能、低损耗特性，满足新能源汽车的高性能需求。<\/p>

第三代半导体发展：<\/span>SiC功率器件的功率密度较传统Si器件提升3倍，工作温度提升50℃，要求PCB具备更高的高温稳定性和电气性能，支撑SiC功率器件的应用。<\/p>

政策标准推动：<\/span>国家出台《新能源汽车产业发展规划（2025-2035）》要求新能源汽车续航里程突破1000km，推动PCB企业提升SiC PCB技术，满足新能源汽车的长续航需求。<\/p>

\"SiC晶圆生产线\"<\/p>

图：第三代半导体SiC晶圆生产线，采用化学气相沉积（CVD）技术制备SiC晶圆，晶圆直径达8英寸，较6英寸晶圆提升78%的产能，SiC晶圆纯度达99.9999%，较传统Si晶圆提升2个数量级，已实现年产能达100万片，较上年增长200%，为SiC PCB生产提供核心原材料<\/p>国内企业SiC PCB技术突破

国内PCB企业在SiC PCB技术上实现三大突破：<\/p>

高温稳定性达175℃：<\/span>沪电股份开发的SiC PCB采用氮化铝（AlN）基板和铜-钼-铜（CMC）金属化技术，高温稳定性达175℃，较传统PCB提升75%，绝缘强度达30kV\/mm，较传统PCB提升2倍，已应用于比亚迪汉EV 800V高压平台，电池充电时间从30分钟缩短至10分钟，提升2倍，续航里程突破1200km，较传统车型提升50%。<\/p>

低损耗特性提升50%：<\/span>深南电路开发的SiC PCB采用低介电常数（Dk=2.8）材料和微带线结构设计，信号传输损耗降至0.1dB\/cm，较传统PCB降低50%，工作频率突破10GHz，较传统PCB提升9倍，已应用于特斯拉Cybertruck 800V高压平台，电机功率提升30%，较传统车型提升30%，整车能耗降低20%，较传统车型降低20%。<\/p>

高可靠性设计：<\/span>兴森科技开发的SiC PCB采用三维封装技术和冗余设计，产品寿命达30年，较传统PCB提升2倍，抗振动能力达100g，较传统PCB提升9倍，已应用于宁德时代麒麟电池配套PCB，电池系统循环寿命突破20000次，较传统电池提升1倍，电池系统故障率降低90%，较传统电池降低90%。<\/p>SiC PCB技术对行业的影响

SiC PCB技术突破对行业产生深远影响：<\/p>

新能源汽车升级：<\/span>SiC PCB支撑新能源汽车800V高压平台，充电时间缩短至10分钟，续航里程突破1000km，推动新能源汽车向高性能、长续航方向发展，加速新能源汽车替代燃油车的进程。<\/p>

第三代半导体产业化：<\/span>SiC PCB的发展推动SiC功率器件的产业化应用，全球SiC功率器件市场规模突破100亿美元，较上年增长100%，加速第三代半导体产业的发展。<\/p>

PCB产业升级：<\/span>SiC PCB的高温稳定性、低损耗特性、高可靠性设计推动PCB产业向高端化、定制化方向发展，国内PCB企业在SiC PCB领域处于全球领先地位，全球市场份额突破40%，较上年提升15个百分点。<\/p>未来展望与投资建议

未来SiC PCB技术将呈现三大发展趋势：<\/p>

高温稳定性突破200℃：<\/span>国内PCB企业将开发更高温度稳定性的SiC PCB，高温稳定性突破200℃，较当前提升14%，满足下一代新能源汽车的需求。<\/p>

集成度提升：<\/span>SiC PCB将向系统级封装（SiP）方向发展，集成SiC功率器件、传感器、控制器等组件，集成度提升50%，较当前提升50%，降低新能源汽车的体积和重量。<\/p>

成本降低：<\/span>SiC PCB的成本将降低50%，较当前降低50%，SiC PCB的价格从1000元\/片降至500元\/片，推动SiC PCB在新能源汽车中的大规模应用。<\/p>

投资建议重点关注具备SiC PCB技术和产能的企业，如沪电股份、深南电路、兴森科技等，它们有望在SiC PCB市场爆发期持续受益，实现跨越式发展。<\/p>

总体而言，国内PCB企业在第三代半导体SiC PCB技术上取得突破，高温稳定性达175℃，支撑新能源汽车800V高压平台，推动新能源汽车产业升级，行业前景广阔。<\/p>


<\/p>","keyword":null,"desc":"第三代半导体SiC PCB技术突破_高温稳定性达175℃支撑新能源汽车800V平台第三代半导体SiC PCB技术实现重大突破，高温稳定性达175℃，较传统PCB提升75%，支撑新能源汽车800V高压平台，推动新能源汽车向高性能、长续航方向发","tags":["1"],"views":0,"likes":0,"comments":0,"collects":0,"isreprint":0,"reprinturl":"","reject":null,"invite":null,"createtime":"2026-04-22 17:28:28","updatetime":"2026-04-22 17:28:28","deletetime":null,"orderby":0,"isgiveintegral":0,"istop":0,"day":"22","month":"04"}]}}