{"code":200,"return":true,"data":{"live":[{"id":308,"categoryid":12,"live_data":{"name":"PCB设计如何降低开关电源干扰","desc":"直播介绍很多开关电源项目，原理图看起来没","templatetype":2,"authtype":2,"publisherpass":921366,"assistantpass":921366,"foreignpublish":"0","openhostmode":0,"hostloginmode":0,"barrage":"","livestarttime":"2026-07-03 20:00","publishurls":[]},"roomid":"5E6D122E06872DF79C33DC5901307461","title":"PCB设计如何降低开关电源干扰","price":"0.00","thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/1b\/d1d2f5becbe60db0438bdcde70ea55.png","orderby":0,"audit":0,"createtime":"2026-07-02 16:03:43","updatetime":"2026-07-05 23:47:20","desc":"直播介绍很多开关电源项目，原理图看起来没问题，但一到测试就出现纹波偏大、干扰严重、系统不稳定等问题。真正的原因，往往不是芯片选错，而是PCB设计没有控制好电流回路、地回流路径和关键器件布局。本场直播将以BUCK拓扑开关电源为例，从电路工作过","content":"

直播介绍<\/p>

很多开关电源项目，原理图看起来没问题，但一到测试就出现纹波偏大、干扰严重、系统不稳定等问题。真正的原因，往往不是芯片选错，而是PCB设计没有控制好电流回路、地回流路径和关键器件布局。<\/span><\/p>

本场直播将以BUCK拓扑开关电源为例，从电路工作过程讲到地弹产生机理，再结合PCB设计案例，帮助硬件工程师和PCB Layout工程师理解：开关电源干扰到底从哪里来，PCB设计阶段应该怎么提前规避。<\/span><\/p>


<\/span><\/p>直播内容

本场直播会先拆解BUCK降压电路的基本工作过程，包括开关闭合、续流、储能和滤波几个关键状态；然后重点讲解地弹产生原因，说明为什么瞬态电流、磁通量变化和环路面积会直接影响电源干扰；<\/span>如何借助国创基础资源库提升效率与作品规范性；<\/span>最后结合BUCK开关电源PCB案例，分析输入电容、功率器件、电感、二极管、输出电容和地回路的布局布线要点，并在直播末尾进行互动答疑。<\/span><\/p>
主题大纲

  1. BUCK拓扑结构电路介绍<\/strong>
    \n讲清开关闭合、续流阶段的电流路径，以及降压变换器的工作逻辑。\n<\/li>\n
  2. 开关电源干扰的关键来源<\/strong>
    \n从瞬态电流、磁通变化、环路面积理解地弹与噪声产生原因。\n<\/li>\n
  3. PCB设计如何减小地弹影响<\/strong>
    \n围绕高di\/dt回路、接地方式、输入输出电容布局、回流路径进行分析。\n<\/li>\n
  4. BUCK拓扑开关电源PCB案例分析<\/strong>
    \n结合实际Layout案例，拆解器件摆放、功率环路、地回路和关键走线问题。\n<\/li>\n
  5. 交流互动，问题解答<\/strong>
    \n解答开关电源纹波、地弹、干扰、布局布线等常见问题。<\/li>\n<\/ol>

    \"57ee72991f94fbb71defe1008b45e8.png\"<\/p>

    注册领取免费使用资格，获取官网链接\/直播回放。
    扫码添加国创客服领取<\/span>
    <\/p>

    \"7aa869c5fdc0bc6de812a4a4b76473.png\"<\/p>
    ","views":663,"uid":24529,"tags":["PCB设计","开挂电源","BUCK拓扑","降压变换器","电源设计"],"status":2,"reject":null,"playstatus":3,"playtime":"2026-07-03 20:00:00","count":1,"comments":0,"likes":1,"collects":2,"hasreplay":1,"deletetime":null,"isnotify":0,"isgiveintegral":1},{"id":307,"categoryid":9,"live_data":{"name":"2026年第十九届成图大赛备赛直播讲解","desc":"直播介绍：本次直播将详细讲解国创基础资源","templatetype":2,"authtype":2,"publisherpass":488176,"assistantpass":488176,"foreignpublish":"0","openhostmode":0,"hostloginmode":0,"barrage":"","livestarttime":"2026-05-22 20:00","publishurls":[]},"roomid":"07D42D51AA0146359C33DC5901307461","title":"2026年第十九届成图大赛备赛直播讲解","price":"0.00","thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/b4\/48ad9aad1fce56cd71dcef2f732252.jpg","orderby":0,"audit":0,"createtime":"2026-05-20 11:34:05","updatetime":"2026-07-05 23:47:24","desc":"直播介绍：本次直播将详细讲解国创基础资源库的使用方法，并通过模拟题实操演示，帮助参赛同学高效备赛，提升作品质量，冲刺好成绩！直播大纲：01、直播背景介绍围绕第十九届成图大赛备赛需求，先介绍本次直播的背景与目的，说明赛前库文件准备的重要性;并","content":"

    直播介绍：<\/b><\/p>

    本次直播将详细讲解国创基础资源库的使用方法，并通过模拟题实操演示，帮助参赛同学高效备赛，提升作品质量，冲刺好成绩！<\/p>


    <\/p>

    直播大纲：<\/b>
    01、直播背景介绍
    围绕第十九届成图大赛备赛需求，先介绍本次直播的背景与目的，说明赛前库文件准备的重要性;并结合AI辅助设计趋势，引出如何借助国创基础资源库提升备赛效率与作品规范性。<\/p>


    02、资源库引入
    介绍国创基础资源库，一站式配齐所需数据，大赛期间免费开放，助力高效备赛库的<\/p>


    03、资源库基本功能讲解
    演示元器件库等功能，讲解目录、筛选、预览、多格式下载等操作<\/p>


    <\/p>

    04、模拟题操作演示<\/p>

    结合模拟题进行实操演示，展示资源库在成图大赛备赛中的实际应用<\/p>


    <\/p>

    05直播结尾与福利
    注册领取免费使用资格，获取官网链接\/直播回放。<\/p>

    扫码添加国创客服领取<\/b><\/p>

    \"7aa869c5fdc0bc6de812a4a4b76473.png\"<\/p>","views":3061,"uid":53688,"tags":["电子竞赛","国创资源库","成图大赛","pcb设计","大学生电赛"],"status":2,"reject":null,"playstatus":3,"playtime":"2026-05-22 20:00:00","count":1,"comments":0,"likes":3,"collects":4,"hasreplay":1,"deletetime":null,"isnotify":0,"isgiveintegral":1},{"id":283,"categoryid":33,"live_data":{"name":"基于高频特性的快速入门EMC分析设计方法","desc":"直播结束后扫码添加助教领取课件直播介绍：","templatetype":2,"authtype":2,"publisherpass":793944,"assistantpass":793944,"foreignpublish":"0","openhostmode":0,"hostloginmode":0,"barrage":"","livestarttime":"2025-06-27 20:00","publishurls":[]},"roomid":"011EEB3D0A75A2B19C33DC5901307461","title":"基于高频特性的快速入门EMC分析设计方法","price":"0.00","thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/ab\/069a61f8f30bba9081f4216ea452b1.jpg","orderby":0,"audit":0,"createtime":"2025-06-26 09:58:57","updatetime":"2026-07-05 23:47:20","desc":"直播结束后扫码添加助教领取课件直播介绍：1小时掌握EMC分析的底层逻辑，彻底搞懂“电磁兼容”到底怎么设计！你还在为EMC问题头疼吗？一堆干扰源、一堆管控措施，却总抓不到重点？这场直播，教你一套“高频视角+三段论” EMC 快速分析法，不看资","content":"

    直播结束后<\/font><\/p>

    扫码添加助教领取课件<\/b><\/font><\/p>

    \"1c41841f13c31cd5c1230e8428a7dc.png\"<\/font><\/p>


    <\/font><\/p>

    直播介绍：<\/b><\/font><\/p>1小时掌握EMC分析的底层逻辑，彻底搞懂“电磁兼容”到底怎么设计！<\/font>
    <\/font>你还在为EMC问题头疼吗？<\/font>一堆干扰源、一堆管控措施，却总抓不到重点？<\/font>这场直播，教你一套“高频视角+三段论” EMC 快速分析法，<\/font>不看资料、不跑仿真，也能快速判断干扰路径和设计缺陷！<\/font>
    <\/font>
    <\/font>直播大纲：<\/b><\/font>

    第一节：EMC的高频特性思维基础<\/b><\/font><\/p>1）为什么说EMC问题本质是“高频信号管理问题”？<\/font>2）高频环境下，电磁干扰是怎么形成的？<\/font>
    <\/font>第二节：导线的高频等效电路图<\/b><\/font>1）普通一根线，高频下却“藏满地雷”？<\/font>2）等效模型一看就懂！<\/font>
    <\/font>第三节：三段论 EMC 快速分析法（独家思维模型）<\/b><\/font>1）高频特性认知<\/font>2）回流路径判断<\/font>3）电压容限评估<\/font>→ 用“结构化思维”，拆解复杂EMC问题！<\/font>
    <\/font>第四节：实战案例讲解——三段论分析法如何落地？<\/b><\/font>真实设计案例，现场带你分析干扰源&对策逻辑<\/font>
    <\/font>第五节：<\/b>课后自检——这套方法，是否也适合你？<\/font>
    <\/b><\/font>
    <\/font>直播亮点：<\/b><\/font>✅ 工程化思维总结：三段论=分析框架+经验窍门<\/font>✅ 0门槛入门EMC：听得懂、记得住、用得上<\/font>✅ 1小时重构你的EMC认知模型<\/font>✅ 不是“EMC百科全书”，而是“方法论工具包”！<\/font>
    <\/font>
    ","views":7509,"uid":144040,"tags":["EMC","电磁兼容","高频","电磁干扰","安规"],"status":2,"reject":null,"playstatus":3,"playtime":"2025-06-27 20:00:00","count":1,"comments":0,"likes":1,"collects":6,"hasreplay":1,"deletetime":null,"isnotify":0,"isgiveintegral":1},{"id":282,"categoryid":16,"live_data":{"name":"反激电源TL431+光耦反馈参数计算全解析","desc":"直播结束后扫码添加助教领取课件直播介绍：","templatetype":2,"authtype":2,"publisherpass":622800,"assistantpass":622800,"foreignpublish":"0","openhostmode":0,"hostloginmode":0,"barrage":"","livestarttime":"2025-06-13 20:00","publishurls":[]},"roomid":"1C2E8CE3013989A69C33DC5901307461","title":"反激电源TL431+光耦反馈参数计算全解析","price":"0.00","thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/6a\/02fabcfba43b640b6802fdde12c4a1.jpg","orderby":0,"audit":0,"createtime":"2025-06-11 17:38:11","updatetime":"2026-07-06 00:57:54","desc":"直播结束后扫码添加助教领取课件直播介绍：随着电源技术和能源技术的发展，反激开关电源在100W以内的领域占据主导地位。其主流控制方式是变压器隔离副边反馈控制。因此，掌握逆变技术势在必行。直播大纲：1：TL431+ PC817规格书解读2：电压","content":"

    直播结束后<\/font><\/p>

    扫码添加助教领取课件<\/b><\/font><\/p>

    \"1c41841f13c31cd5c1230e8428a7dc.png\"<\/font><\/p>


    <\/font><\/p>

    直播介绍：<\/b><\/font><\/p>

    随着电源技术和能源技术的发展，反激开关电源在100W以内的领域占据主导地位。其主流控制方式是变压器隔离副边反馈控制。因此，掌握逆变技术势在必行。<\/font><\/p>


    <\/font><\/p>

    直播大纲：<\/b><\/font><\/p>

    1：TL431+ PC817规格书解读
    2：电压反馈电阻计算取值
    3：光耦的电流输出曲线工作点设置
    4：TL431+光耦偏置电阻的计算
    5：电压波动占空比整体调节变化
    <\/font><\/p>


    <\/font><\/p>

    主要讲了哪些知识点：<\/b><\/font><\/p>

    1：TL431器件内部框图和规格书解读
    2：PC817规格书解读
    3：UC384X内部反馈控制逻辑解读
    4：电压反馈电阻计算取值
    5：TL431+光耦偏置电阻的计算
    6：光耦的电流输出曲线工作点设置
    7：电压环两种经典反馈电路介绍
    8：电压波动，占空比控制的整体调节
    <\/font><\/p>


    <\/font><\/p>

    能掌握哪些内容：<\/b><\/font><\/p>

    1：掌握TL431+PC817器件特性
    2：掌握TL431+PC817反馈的调节原理
    3：TL431+PC817外围参数计算
    4：掌握UC384X内部框图反馈调节思路
    5：反馈参数计算取值需要验算
    6：能读懂PC817电流传输曲线图
    <\/font><\/p>

    \"a3c975d82aa5628952e6886902bf76.png\"<\/p>

    \"669aa5f7b959c82b42e0d8aec3d07d.png\"<\/p>

    \"3cfc6cbeaad940bdf773f72934baf4.png\"<\/p>","views":6422,"uid":2286,"tags":["反激电源","开关电源","光耦","TL431","变压器"],"status":2,"reject":null,"playstatus":3,"playtime":"2025-06-13 20:00:00","count":1,"comments":0,"likes":1,"collects":17,"hasreplay":1,"deletetime":null,"isnotify":0,"isgiveintegral":1}],"newCourse":[{"id":22177,"uid":24529,"title":"开关电源300WPFC+LLC+SR一对一弟子计划","desc":"","price":"5499.00","content":"

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    \"O1CN01ZvJE5P1lWox8FKBe9_!!3973574827.jpg\"<\/p>","orderby":0,"categoryid":16,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/19\/aa4b9e62079d0250e16453f5711eb2.png","buycount":5,"count":3,"likes":0,"views":314,"comments":0,"collects":0,"reject":null,"invite":0,"createtime":"2026-06-18 11:17:42","updatetime":"2026-07-05 23:00:52","deletetime":null,"tags":["电源工程师","PFC","LLC","SR"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22176,"uid":24529,"title":"凡亿 USB HUB扩展器 原理设计与调试教程","desc":"需要领取技术资料扫码添加领取","price":"499.00","content":"

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    \"dd45a63b4261f9442395e6a1a6f07d.png\"<\/p>","orderby":0,"categoryid":5,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/f8\/cfa9c06a80139e4e4f084fe44ff282.png","buycount":27,"count":12,"likes":0,"views":753,"comments":0,"collects":0,"reject":null,"invite":0,"createtime":"2026-06-02 11:17:53","updatetime":"2026-07-05 23:01:42","deletetime":null,"tags":["HUB","扩展器","原理图","USB","PCB设计"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22175,"uid":24529,"title":"2026年全国PCB成图大赛|嘉立创EDA专业版全套实操教学","desc":"2026全国PCB成图大赛嘉立创EDA专业版真实还原国赛现场独家效率工具包让你的设计速度提升200%","price":"0.00","content":"

    2026全国PCB成图大赛<\/p>

    嘉立创EDA专业版 <\/p>

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    \"dd45a63b4261f9442395e6a1a6f07d.png\"<\/p>","orderby":0,"categoryid":9,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/02\/7b0d436c8baa94466981e9e38b2d76.jpg","buycount":102,"count":17,"likes":3,"views":1116,"comments":1,"collects":10,"reject":null,"invite":0,"createtime":"2026-05-07 17:25:47","updatetime":"2026-07-06 00:49:38","deletetime":null,"tags":["成图大赛","大学生电子竞赛","电路设计","pcb设计","嘉立创"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22174,"uid":24529,"title":"Altium Designer 26 | 电赛声源智能小车PCB设计培训视频实战教程","desc":"很多电子设计的新手或者大学生毕业会有这样的迷茫：学校教的东西很通常是理论，动手实践操作可能不是很重要，初入岗位的时候就完全相反了，实践操作能力需要摆在第一位，但是这些实践操作能力又如何去学呢，自学的话效率低不说，还不知道如何下手。针对市面上","price":"0.00","content":"

    很多电子设计的新手或者大学生毕业会有这样的迷茫：学校教的东西很通常是理论，动手实践操作可能不是很重要，初入岗位的时候就完全相反了，实践操作能力需要摆在第一位，但是这些实践操作能力又如何去学呢，自学的话效率低不说，还不知道如何下手。<\/p>

    针对市面上这种情况，凡亿教育作为电子设计在线教育领军者，我们适时推出此套全流程的电子设计实战视频，满足学员的学习需求。<\/p>

    本套教程采用全新版本的 Altium Designer 26来分阶段讲解，从创建原理图库、原理图、PCB库到PCB设计的布局布线，全流程给大家直播讲解和交流。每个器件是怎么画的？怎么摆放的？每一根线怎么拉线？哪些是电源线？哪些是信号线？<\/b>这些都会一个一个的详细讲解，新手一般看一遍就能够自己动手了。从无到有整个环节都说得清清楚楚，这样作为新手才能够真正学到东西。<\/p>

    配套的素材扫码领取<\/p>

    \"cb6201fc0cdee31ae0a2fdca40189f.png\"<\/p>

    \"83c4509e9212e2f9a6f1c900943972.png\"\"813debf0594b729a676619db57e6a8.png\"

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    本课程定位主要是入门，采用“项目驱动+手把手教学”的模式。<\/p>

    通过采用全新的Altium Designer 26 EDA工具软件，设计一个大学生智能车竞赛中经常用到的电机驱动电路板，产品不是很复杂，\n但我们基于一个电子产品开发的整个流程来进行讲解：原理图的器件选型与设计到PCB布局与布线的全流程，涵盖元元器件的选型、电路的搭建、PCB工程搭建、PCB的导入、PCB布局布线等核心环节，同步融入生产文件输出等工程化设计要点，每一个环节给学员进行细致的讲解和实操演示，过程中也会涉及一些元器件的基本特性与PCB设计的常用概念，能够对入门的学员的基础做一个补充，卡点式教学，力求新手听完就能动手操作的状态。<\/p>

    希望新手通过本套视频全部掌握利用Altium Designer软件进行电子设计的基本流程，以及2层电路板的设计要点和方法，让我们从完全的小白正式跨入电子设计这个圈子。<\/p>

    学习素材扫码领取<\/p>

    \"cb6201fc0cdee31ae0a2fdca40189f.png\"<\/p>","orderby":0,"categoryid":13,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/f5\/b84bf43ff3c199517e98e08cb50e69.jpg","buycount":51,"count":26,"likes":0,"views":768,"comments":0,"collects":4,"reject":null,"invite":0,"createtime":"2026-04-25 13:44:59","updatetime":"2026-07-06 00:05:01","deletetime":null,"tags":["智能车","电机驱动","PCB设计","电路设计","驱动调试"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22172,"uid":24529,"title":"2026年Altium Designer电子类成图大赛省赛赛前培训 | 实战视频教程（高分冲刺）","desc":"本次课程全程采用Altium Designer作为设计平台，以2025年省赛真实赛题为实战案例，从软件环境的安装配置，到最终设计文件的完整输出，逐一拆解赛题中的每一个考核点。课程采用“手把手”式演示，步骤清晰、节奏合理，确保学员能够跟上操作","price":"0.00","content":"

    本次课程全程采用Altium Designer作为设计平台，以2025年省赛真实赛题为实战案例，从软件环境的安装配置，到最终设计文件的完整输出，逐一拆解赛题中的每一个考核点。课程采用“手把手”式演示，步骤清晰、节奏合理，确保学员能够跟上操作、理解原理。我们不仅带领大家完整走通PCB设计的全流程，更注重将Altium Designer的软件技巧与工程理论有机结合，同时穿插快捷键定制、效率提升等实用技能，切实提升参赛者的综合设计能力。<\/p>


    <\/p>

    课程内容全面覆盖省赛常见考点，由基础操作逐步过渡到高阶技巧，重点解析高速信号处理、多模块协同布局、约束规则设置等难点模块。后期我们还将提供进阶训练与冲刺阶段的专项指导，为选手持续提升提供系统保障。欢迎关注“凡亿教育”，获取最新课程信息、赛题动态及备考干货，让我们携手备战2026成图大赛，亿起加油！<\/p>

    课程配套资源获取：<\/b>Fydz365a<\/p>

    （备注：成图大赛）<\/b><\/p>

    \"cb6201fc0cdee31ae0a2fdca40189f.png\"<\/p>


    <\/p>","orderby":0,"categoryid":5,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/f6\/6fc309f950f3beabe6c76bad0f5470.jpg","buycount":40,"count":16,"likes":0,"views":693,"comments":0,"collects":4,"reject":null,"invite":0,"createtime":"2026-04-24 15:32:09","updatetime":"2026-07-05 18:47:26","deletetime":null,"tags":["成图大赛","电子大赛","pcb设计","大学生竞赛","电赛"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22171,"uid":24529,"title":"Cadence Orcad X and Allegro X 25.1安装视频","desc":"电子设计资料扫码领取","price":"0.00","content":"

    电子设计资料<\/p>

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    \"dd45a63b4261f9442395e6a1a6f07d.png\"<\/p>","orderby":0,"categoryid":6,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/66\/5bb2d5fa15a3bbed9945c27ad3d520.png","buycount":39,"count":1,"likes":0,"views":502,"comments":0,"collects":1,"reject":null,"invite":0,"createtime":"2026-04-02 10:08:52","updatetime":"2026-07-05 21:52:28","deletetime":null,"tags":["Cadence","Orcad","安装教程","allgro"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22170,"uid":24529,"title":"Altium Designe25 2层国产GD32开发板PCB设计入门实战课程","desc":"课程配套的素材链接扫码领取","price":"129.00","content":"

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    \"dd45a63b4261f9442395e6a1a6f07d.png\"<\/p>","orderby":0,"categoryid":12,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/26\/f4fd696aec3b1fa6427b0fad496bc4.png","buycount":63,"count":49,"likes":0,"views":4343,"comments":0,"collects":3,"reject":null,"invite":0,"createtime":"2026-04-01 16:30:45","updatetime":"2026-07-05 22:36:49","deletetime":null,"tags":["GD32","AD25","原理图","PCB封装","电源"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22169,"uid":24529,"title":"国产软件三微EDA零基础PCB设计入门课程","desc":"扫码添加助教领取配套的课件","price":"0.00","content":"

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    领取配套的课件<\/p>

    \"dd45a63b4261f9442395e6a1a6f07d.png\"<\/p>","orderby":0,"categoryid":11,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/8b\/bd8015357ac1d28962eb8f98471852.jpg","buycount":151,"count":76,"likes":0,"views":1466,"comments":0,"collects":9,"reject":null,"invite":0,"createtime":"2026-03-06 17:14:09","updatetime":"2026-07-05 22:11:30","deletetime":null,"tags":["三微电子","EDA","PCB设计"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22168,"uid":2286,"title":"数字电路","desc":"","price":"0.00","content":"

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    频综第二期视频回放 <\/p>","orderby":0,"categoryid":17,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/1d\/4b6114ddc09c5e1a6d28d61574490a.jpg","buycount":12,"count":27,"likes":1,"views":1165,"comments":0,"collects":2,"reject":null,"invite":0,"createtime":"2025-12-20 09:23:05","updatetime":"2026-07-05 07:46:34","deletetime":null,"tags":["微波","射频","天线","5G","HFSS"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22166,"uid":24529,"title":"PCB软件操作速成合集（AD\/Allegro\/Pads）","desc":"素材课件扫码添加领取","price":"9.90","content":"

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    \"1c41841f13c31cd5c1230e8428a7dc.png\" <\/p>","orderby":0,"categoryid":12,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/3c\/9169a8bde228774b58386fe07a30bb.jpg","buycount":1141,"count":431,"likes":6,"views":68176,"comments":5,"collects":53,"reject":null,"invite":0,"createtime":"2025-12-11 14:10:16","updatetime":"2026-07-06 00:14:30","deletetime":null,"tags":["电子设计","PCB培训","PCB软件","EDA工具"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"}],"goodcourse":[{"id":22166,"uid":24529,"title":"PCB软件操作速成合集（AD\/Allegro\/Pads）","desc":"素材课件扫码添加领取","price":"9.90","content":"

    素材课件扫码添加领取<\/p>

    \"1c41841f13c31cd5c1230e8428a7dc.png\" <\/p>","orderby":0,"categoryid":12,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/3c\/9169a8bde228774b58386fe07a30bb.jpg","buycount":1141,"count":431,"likes":6,"views":68176,"comments":5,"collects":53,"reject":null,"invite":0,"createtime":"2025-12-11 14:10:16","updatetime":"2026-07-06 00:14:30","deletetime":null,"tags":["电子设计","PCB培训","PCB软件","EDA工具"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":21528,"uid":24529,"title":"2024年飞龙套餐（PCB、硬件、EMC、单片机）","desc":" ","price":"5599.00","content":"

    \"690ed2ff79ccf376860c4ba908efc0.png\"        <\/p>","orderby":0,"categoryid":13,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/b7\/4cac0b32e534c7e5adf502fb958d92.jpg","buycount":2350,"count":845,"likes":62,"views":445586,"comments":27,"collects":244,"reject":null,"invite":0,"createtime":"2024-01-06 16:33:40","updatetime":"2026-07-05 23:43:12","deletetime":null,"tags":["PCB设计","硬件设计","EMC","单片机"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":"course_9999","ipaprice":"5599.00"},{"id":21703,"uid":24529,"title":"【第13期】射频电路实战特训班","desc":"","price":"6999.00","content":"

    \"O1CN012Ii9OJ1J7ngUQqrtG_!!2207926780982.jpg\"
    <\/p>","orderby":0,"categoryid":17,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/54\/303b88e8f65aad932e9877e9697ca5.jpg","buycount":36,"count":24,"likes":1,"views":4177,"comments":0,"collects":4,"reject":null,"invite":0,"createtime":"2024-09-04 10:51:14","updatetime":"2026-07-06 00:48:58","deletetime":null,"tags":["射频","ADS","HFSS","版图","仿真"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":20563,"uid":58261,"title":"【第三期】射频电路实特训班","desc":"","price":"6999.00","content":"

    \"1626059908967745.jpg\"\"1626059924477254.jpg\"\"1626059939331217.jpg\"\"1626059940558486.jpg\"\"1626059940409421.jpg\"\"1626059941447099.jpg\"\"1626059941608769.jpg\"\"1626059941957909.jpg\"<\/p>","orderby":0,"categoryid":22,"status":2,"keywords":"【第三期】射频电路实特训班","thumb":"https:\/\/api.fanyedu.com\/public\/uploads\/image\/course\/20211129\/a947d0eb534c533319d1fdbae1d40460.png","buycount":15,"count":15,"likes":1,"views":21573,"comments":0,"collects":4,"reject":"","invite":0,"createtime":"2021-11-21 11:34:40","updatetime":"2026-07-05 14:06:37","deletetime":null,"tags":["高频电路","射频电路","电路仿真"],"annex":null,"hot":0,"isgiveintegral":0,"ipaid":"course_9999","ipaprice":"6999.00"},{"id":672,"uid":7433,"title":"Allegro四层零基础入门实战pcb视频教程","desc":"1. 掌握运用Allegro软件设计PCB的全部流程 2.掌握Allegro软件绘制PCB中的操作技巧 3.掌握Allegro软件的快捷键运用、提高PCB设计效率 4. 掌握四层板设计过程中电源与地平面的处理方法","price":"88.80","content":"

    说明：<\/strong><\/span><\/p>

    1、平台上只放了试听部分的课程，可以在本平台下单，之后联系下方助教进行授权全套课程播放<\/strong><\/span><\/p>

    2、可以淘宝平台购买之后进行全套视频授权（点击右侧链接打开淘宝店铺→）：https:\/\/item.taobao.com\/item.htm?spm=a1z10.5-c-s.w4002-21870440440.14.333f6f50Ty8HD6&id=593406012491<\/a><\/strong><\/span><\/p>

    3、助教联系方式（微信扫一扫添加）：<\/strong><\/span><\/p>

    \"image.png\"\/\"image.png\"\/\"image.png\"\/\"image.png\"\/<\/p>

    <\/p>

    \"image.png\"\/\"image.png\"\/\"image.png\"\/\"image.png\"\/\"image.png\"\/<\/p>

    <\/p>","orderby":0,"categoryid":6,"status":2,"keywords":"Allegro实战视频","thumb":"https:\/\/api.fanyedu.com\/public\/uploads\/image\/course\/20200810\/eb34ca98604f448dceb8051ed43ed52c.jpg","buycount":3,"count":1,"likes":0,"views":6124,"comments":0,"collects":7,"reject":"","invite":0,"createtime":"2020-08-10 11:26:16","updatetime":"2026-07-05 08:55:08","deletetime":null,"tags":["Allegro实战视频","allegro教程","Allegro零基础入门"],"annex":null,"hot":0,"isgiveintegral":0,"ipaid":"course_999","ipaprice":"99.90"},{"id":20570,"uid":7433,"title":"不规则模型建模演示","desc":"课程：快速掌握在hfss中进行圆环，扇形，弧面等非规则模型的快速建模，掌握hfss中线，面的转化，和非规则图形的构建。对应的课程请扫码联系助教","price":"199.00","content":"

    课程：快速掌握在hfss中进行圆环，扇形，弧面等非规则模型的快速建模，掌握hfss中线，面的转化，和非规则图形的构建。<\/p>


    <\/p>

    对应的相关课程请联系助教<\/b><\/p>

    \"124e2ef3f76c9e29a8b7a9ce5384b8.png\"<\/p>","orderby":0,"categoryid":17,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/fe\/f2ff1860d2190fdf55d571843ee503.jpg","buycount":20,"count":1,"likes":0,"views":4158,"comments":0,"collects":5,"reject":null,"invite":0,"createtime":"2022-01-10 17:42:25","updatetime":"2026-07-05 23:29:29","deletetime":null,"tags":["5G","手机天线","终端天线"],"annex":null,"hot":0,"isgiveintegral":0,"ipaid":"course_9999","ipaprice":"199.00"},{"id":21732,"uid":30525,"title":"射频高功率放大器设计技术与工程实践","desc":"1 ","price":"6999.00","content":"

    \"84084f1926e17bee67d11eea9696b6.png\"<\/p>

    1    <\/p>","orderby":0,"categoryid":17,"status":1,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/71\/2668e7ba496aeb682585de19704f4f.jpg","buycount":81,"count":22,"likes":0,"views":4067,"comments":0,"collects":1,"reject":null,"invite":0,"createtime":"2024-11-05 09:54:20","updatetime":"2026-06-21 04:15:18","deletetime":null,"tags":["半导体","射频","大功率","功放"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":670,"uid":7433,"title":"Allegro6层RK3288平板电脑PCB视频教程","desc":"1、了解平板电脑的设计总体要求及设计框架 2、掌握电子设计的流程化设计 3、了解设计当中涉及到的基本概念 4、掌握PCB设计的布局布线规划 5、 掌握软件模块化布局技巧 6、掌握各类接口器件和功能模块的布局布线要点 7、常见EMC\/EMI的处理方式及注意事项","price":"298.80","content":"

    说明：<\/strong><\/span><\/p>

    1、平台上只放了试听部分的课程，可以在本平台下单，之后联系下方助教进行授权全套课程播放<\/strong><\/span><\/p>

    2、可以淘宝平台购买之后进行全套视频授权（点击右侧链接打开淘宝店铺→）：https:\/\/item.taobao.com\/item.htm?spm=a1z10.5-c-s.w4002-21870440440.11.75076f500Oyjfn&id=593921774292<\/a><\/strong><\/span><\/p>

    3、助教联系方式（微信扫一扫添加）：<\/strong><\/span><\/p>

    <\/p>

    <\/p>","orderby":0,"categoryid":6,"status":2,"keywords":"Allegro","thumb":"https:\/\/api.fanyedu.com\/public\/uploads\/image\/course\/20200810\/0edbacbff994f84d932056fd8835ab13.jpg","buycount":6,"count":1,"likes":0,"views":5483,"comments":0,"collects":8,"reject":"","invite":0,"createtime":"2020-08-10 11:01:43","updatetime":"2026-07-06 00:22:54","deletetime":null,"tags":["allegro","PCB视频教程","RK3288"],"annex":null,"hot":0,"isgiveintegral":0,"ipaid":"course_9999","ipaprice":"298.80"},{"id":21588,"uid":24529,"title":"飞龙套餐allegro篇（PCB、硬件、EMC、单片机）","desc":" ","price":"5599.00","content":"

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    \"O1CN01GvdqQ21lWoZ8UUMu8_!!3973574827.jpg\"\/\"08adf94ad0d4e2a8d9583c5b5fa640.png\"\/<\/p>\"O1CN018kxZGh1lWoZ5N0eWl_!!3973574827.jpg\"\/","orderby":0,"categoryid":17,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/b6\/c59ca3a053b8608190cf0ca4a64b1c.png","buycount":34,"count":54,"likes":0,"views":11906,"comments":0,"collects":6,"reject":null,"invite":0,"createtime":"2023-01-03 16:53:20","updatetime":"2026-07-05 23:33:42","deletetime":null,"tags":["射频","天线","相控阵列"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":"course_9999","ipaprice":"7499.00"},{"id":20875,"uid":58261,"title":"【第一期】90天相控阵开发实战特训","desc":"","price":"7499.00","content":"

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    <\/p>","orderby":0,"categoryid":7,"status":2,"keywords":"PADS VX2.4,STM32","thumb":"https:\/\/api.fanyedu.com\/public\/uploads\/image\/course\/20191012\/3742eda7ca4172ab59717594e9f32168.png","buycount":8,"count":34,"likes":4,"views":9709,"comments":0,"collects":11,"reject":"","invite":0,"createtime":"2019-10-12 15:53:21","updatetime":"2026-07-05 23:38:12","deletetime":null,"tags":["pads","差分线","只读"],"annex":null,"hot":0,"isgiveintegral":0,"ipaid":"course_699","ipaprice":"69.90"}],"article":[{"id":124433,"uid":178486,"title":"当机器人开始进厂，硬件工程师更该补的不是“会不会被替代”，而是系统能力","status":2,"categoryid":13,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/03\/c113d658c94094302516ef1c72a9ee.png","multiple_thumb":["https:\/\/api.fanyedu.com\/uploads\/image\/03\/c113d658c94094302516ef1c72a9ee.png","https:\/\/api.fanyedu.com\/uploads\/image\/df\/6f0ac971d9b636b84ffd569424a339.png","https:\/\/api.fanyedu.com\/uploads\/image\/80\/0f7bcbfc03e51a1ba01cb57d67d45c.png"],"content":"

    近7天里，两条行业消息很值得电子类学生和初级工程师认真看：一条是 2026 年 6 月 26 日，onsemi 宣布将以约70亿美元全股票方式收购Synaptics，强调把电源、感知、连接、计算与控制做成更完整的边缘AI平台；另一条是2026年6月30日，BMW在美国 Spartanburg 工厂继续推进 Figure 03 humanoid robot 落地，把“Physical AI”从概念推向真实产线。对想做PCB、硬件、嵌入式、汽车电子、机器人方向的人来说，这两条新闻真正传递出的信号不是“热点来了”，而是企业对工程师的要求，正在从单点技能转向系统能力。<\/p>

    \"c113d658c94094302516ef1c72a9ee.png\"<\/p>

    这两天，如果你同时关注电子制造、汽车电子和AI硬件，会发现一个非常清晰的行业变化。<\/p>

    2026年6月26日，onsemi 宣布将以约70亿美元全股票方式收购Synaptics。市场讨论很多，有人看重资本动作，有人盯着股价波动，但对学习者来说，更值得看的其实是这笔交易背后的方向判断。onsemi原本强在功率器件、传感与汽车、工业场景，Synaptics 强在人机交互、连接与边缘侧计算能力。两者放在一起，拼出来的不是单颗芯片更强，而是一条更完整的“感知 + 供电 + 控制 + 连接 + 边缘智能”链路。说得直白一点，未来越来越多硬件项目不会只问你“会不会画板”，而会问你能不能把板卡、接口、电源、控制逻辑和落地场景串成一套能工作的系统。<\/b><\/p>

    再看另一条消息。2026年6月30日，BMW 在美国Spartanburg工厂继续推进 Figure 03 humanoid robot 的部署，把它放进真实物流和制造节拍里去验证。这条新闻真正重要的地方，不是“机器人又上热搜了”，而是它说明 Physical AI正在走出实验室。对汽车电子、机器人、嵌入式和工业控制方向来说，这意味着岗位对工程师的期待正在上移。企业不再只需要懂单一模块的人，而更需要能理解整机协同、接口匹配、供电稳定性、EMC 风险、调试路径和现场约束的人。<\/p>

    很多学生和刚入行的工程师，最容易踩的坑，就是把成长理解成“多学几个软件”或者“多记几个知识点”。<\/b>会AD、会PADS、会Cadence，当然重要；会看原理图、知道常见接口协议，也当然重要。但一旦进入项目和面试，问题马上就变了。<\/p>

    面试官不会只停留在“你画过什么板”，而会继续追问：<\/p>

    这块板为什么这样分区<\/p>

    电源架构为什么这么选？<\/p>

    高速或敏感信号为什么这样走线？<\/p>

    地回流怎么考虑？<\/p>

    EMC风险点在哪里？<\/p>

    第一次上电为什么先看这几个节点？<\/p>

    联调失败时你会先怀疑时钟、复位、供电，还是接口时序？<\/p>

    这类问题的共同点在于，它们都不考“你背没背过”，而考“你有没有经历过一个完整工程闭环”<\/b>。<\/b>这恰恰是很多学习者最缺的一段。学校课程能解决基础理论，网上资料能帮助入门软件，但从原理图到PCB，从焊接到上电，从单板调试到整机联调，从发现问题到复盘表达，这中间那段最像真实工作的训练，往往才是拉开差距的地方。<\/p>

    \"6f0ac971d9b636b84ffd569424a339.png\"<\/p>

    为什么今天这个缺口反而更重要？<\/b><\/p>

    因为AI硬件、汽车电子、机器人这些热门方向，看起来很新，底层却越来越“硬”。机器人要稳定动作，靠的是供电、驱动、传感器接入、控制链路、结构配合和现场容错；汽车电子要可靠上车，靠的是器件选型、接口稳健、抗干扰、热设计和验证流程；边缘AI真想落地，也离不开板级实现、系统功耗、算力约束、通信链路和调试能力。越是前沿行业，越离不开这些基本功，而且这些基本功必须能组合成系统结果，而不是零散存在。<\/p>

    这也是为什么，很多人明明学过不少内容，真正找工作时却依然心里没底。<\/b>不是不会，而是不敢确认自己是否“能干活”。原因通常不是智力问题，而是缺少可验证的训练证据。你可能知道Buck电源的工作原理，也知道MCU、传感器、串口、CAN、SPI、I2C 是什么，但如果没有亲手做过连接、焊接、上电、抓波形、定位异常、修板、复盘，你对自己的能力判断就会一直悬着。企业也很难只靠一句“我学过”来相信你。<\/p>

    所以，对电子专业大学生、刚毕业想做硬件\/PCB工程师的人、1到3年的初级工程师，甚至转岗学习者来说，最有效的提升路径不是继续碎片化堆知识，而是尽快把能力往三个方向收拢。<\/p>

    \"cf82887b2fa6ecd53dbab750052911.png\"<\/p>

    第一，补系统基础。<\/b>不是只懂一个点，而是把电源、接口、器件、布局布线、EMC、调试顺序这些关键模块连起来，知道一个项目为什么这么设计，而不是只知道软件按钮怎么点。<\/p>

    \"c2c505ae5fb2ff0f24ad9a6ee7d941.png\"<\/p>

    第二，做完整项目。<\/b>项目不一定非要很大，但一定要完整。哪怕是一块功能板、一个小型嵌入式控制系统、一个带传感器和通信接口的应用板，只要你完整经历过方案、设计、实现、上电、调试、复盘，它就比十几条零散学习记录更有价值。<\/p>

    \"0f7bcbfc03e51a1ba01cb57d67d45c.png\"<\/p>

    第三，练表达能力。<\/b>很多人会做事，但不会讲。可现实是，面试、转岗、答辩、汇报，都要求你把问题背景、设计思路、取舍逻辑、调试过程和最终结果说清楚。项目能力决定你能不能做事，表达能力决定别人能不能看见你会做事。<\/p>

    PCB工程能力的系统搭建。凡亿线下培训明确写到，训练路径不是直接丢一个大项目上手，而是按“硬件基础知识 -> EDA软件基础 -> 常见PCB设计模块 -> 2\/4\/6\/8 层综合案例”往前推进。<\/b>前面先补电阻、电容、电感、二极管、三极管、MOS管、运放等基础，再进入 AD、Cadence Allegro、Mentor PADS 三类主流 EDA 工具的操作，然后把 DCDC、LDO、PMU、DDR、USB、HDMI、RJ45、差分线、阻抗、叠层、BGA 出线、SI\/PI、EMC、DFM\/DFA 这些设计里绕不过去的模块和规则逐步打通。<\/p>

    \"f89f0cc0fc734c0fa94ae0961ebdd6.png\"<\/p>

    更关键的是，它不是只停留在“会画”，而是把不同难度的综合案例明确放进训练过程。根据这份PCB大纲，案例覆盖了3500W直流充电桩大功率PCB、4层全志 H616 TV Box、6层 RK3576 AIoT主板，以及8层 RK3588 综合工业主板（选学）<\/b>。这些名字本身并不是重点，重点是它们背后对应的训练逻辑：大功率电源板考验安规、爬电间距、电气间隙、电源环路和EMC；消费类板子考验高密度布局布线和成本约束；AIoT和工业主板则把高速接口、LPDDR、PCIe、屏蔽罩、综合规划、SI\/PI 和可靠性问题放到更真实的工程环境里。对想走PCB路线的人来说，这种训练的价值就在于，它不是教你做一块板，而是教你面对不同产品时，如何拆模块、抓重点、做取舍。<\/b><\/p>

    \"e88145ab48559614f9da40e69c1677.png\"<\/p>

    从这个角度看，线下课堂训练的价值并不在于“热闹”或者“听得更过瘾”，而在于它更容易逼近真实工程节奏。有人带着你按步骤做，有人盯着你为什么这样选型、为什么这样布局、为什么这次先查供电再查时钟，也有人在你做完之后要求你复盘并讲清楚。对起步阶段的学习者来说，这种训练的意义，是把抽象知识变成手上的工程记忆，把“知道”变成“做过”，再把“做过”变成“说得明白”。<\/b><\/p>

    \"d51d036ac8c7e097111f432e7ede79.png\"<\/p>

    所以，如果你现在正处在“想进入这个行业，但不知道该先补什么”的阶段，可以把方向先分清楚：如果你更想走 PCB 设计路线，重点就该放在硬件基础、EDA工具、模块化设计思维、叠层阻抗、EMC和综合项目上；如果你更想走硬件电路开发路线，重点就该放在常见电路原理、器件特性、仿真、MCU控制、调试分析和实物闭环上。路线不同，训练重点不同，但底层规律是一致的，最后都要回到“能不能把系统做出来、调出来、讲明白”。<\/p>

    凡亿教育这些年持续服务的，也正是这类人群：<\/b><\/p>

    想进入硬件、PCB、嵌入式、汽车电子方向的学生，工作一两年后意识到自己还缺系统能力的初级工程师，以及希望少走弯路的转岗学习者。对于这类受众，真正值得关注的不是短期噱头，而是自己能不能尽快建立一套更扎实的能力闭环。热点会变，岗位名称会变，产业风口也会变，但硬件工程的底层规律并不会变。越早把基础、实操、项目和表达连成闭环，越有可能在下一轮行业机会里站稳。<\/p>","keyword":null,"desc":"近7天里，两条行业消息很值得电子类学生和初级工程师认真看：一条是 2026 年 6 月 26 日，onsemi 宣布将以约70亿美元全股票方式收购Synaptics，强调把电源、感知、连接、计算与控制做成更完整的边缘AI平台；另一条是202","tags":["硬件工程师","机器人","电子制造"],"views":62,"likes":0,"comments":0,"collects":0,"isreprint":0,"reprinturl":null,"reject":null,"invite":0,"createtime":"2026-07-03 17:51:07","updatetime":"2026-07-05 23:47:18","deletetime":null,"orderby":0,"isgiveintegral":1,"istop":0,"day":"03","month":"07"},{"id":124432,"uid":190214,"title":"英伟达Rubin架构改写PCB价值坐标 单机价值量飙升至传统服务器3倍以上","status":2,"categoryid":35,"thumb":"https:\/\/s.coze.cn\/image\/W1O5i0ILDPA\/","multiple_thumb":"","content":"

    英伟达Rubin架构改写PCB价值坐标 单机价值量飙升至传统服务器3倍以上<\/p>

    导语：<\/strong>2026年下半年，英伟达新一代Vera Rubin平台将正式量产出货。这一架构不仅在芯片算力上实现飞跃，更从底层硬件设计层面彻底改写了PCB的价值坐标——从被动连接件跃升为芯片最后一层封装载体，单机PCB价值量飙升至传统服务器的3倍以上，行业格局正在经历根本性重塑。<\/p>

    \"W1O5i0ILDPA\"<\/p>

    一、Rubin架构对PCB的颠覆性需求<\/strong><\/p>

    据凤凰网财经（https:\/\/finance.ifeng.com\/c\/8uQTonTGOn0）报道，随着英伟达Hopper迭代至Rubin\/Rubin Ultra架构，叠加谷歌TPU、AMD MI系列ASIC芯片算力密度指数级提升，AI服务器对PCB提出了全新的严苛标准：需要支撑112G\/224G高速SerDes互联，介质损耗控制至Df≤0.002，线宽线距精细度缩小至30μm以内，同时采用密度远超传统产品的盲埋孔、叠孔堆叠结构。<\/p>

    产品规格方面出现明显升级：算力主板、加速卡基板层数普遍提升至18-30层超高多层；整机正交高速背板方案层数可达70-80层，生产端必须配套6阶及以上高阶HDI或mSAP半加成精密工艺。传统服务器PCB仅8-16层，单台价值约650元；而Rubin架构AI服务器的正交背板可达78层，单机PCB价值量飙升至2800-3500元，单机柜PCB价值突破80万元。<\/p>

    二、CoWoP方案：PCB从连接件到封装载体的根本跃迁<\/strong><\/p>

    更具里程碑意义的是，国金证券2026年5月深度报告提出了一个标志性判断：CoWoP（Chip-on-Wafer-on-PCB）方案正在打破PCB与封装基板的边界。该方案去掉传统CoWoS中的ABF封装基板与BGA焊球，将硅中介层与GPU\/HBM直接安装在强化型Platform PCB上——这意味着强化PCB要承担原属封装基板的电气与机械功能，对板材均匀性、翘曲控制、超低损耗介质提出近乎载板级要求。<\/p>

    国金证券分析师在报告中指出：\"这是PCB与封装基板边界消失的标志性事件，标志着PCB从被动连接件向主动封装载体的根本性跃迁。\"虽然量产时间表还存在不确定性，但高端PCB\"承接更多功能\"已是行业共识。这一趋势意味着，未来PCB厂商需要具备传统上与封装基板厂商竞争的技术能力，行业壁垒进一步抬高。<\/p>

    三、市场数据印证：高端板增速碾压低端品类<\/strong><\/p>

    Prismark披露的数据清晰呈现了这种结构性变化：2025年全球PCB总产值预计增长15.8%至851.52亿美元，但内部分化极端——18层及以上超高多层板产值增速高达72.8%；高阶HDI增速26%；而单\/双面板、4-6层常规硬板增速仅约6.2%。<\/p>

    IDC预测，2024-2029年全球服务器市场年均复合增长率将达18.8%，其中加速型服务器支出年均增速达20%以上。以加速型x86为例，2024年全球支出为1130亿美元，预计至2029年将增至3260亿美元，CAGR高达23.7%。这意味着Rubin及后续架构对高端PCB的拉动效应将持续至少5年。<\/p>

    四、延伸展望：PCB行业价值体系正在重构<\/strong><\/p>

    英伟达Rubin架构的量产不仅是一次产品迭代，更是PCB行业价值体系的重构。当PCB从\"电子之母\"的连接件角色，跃升为算力芯片的核心封装载体，整个行业的竞争规则、技术门槛和利润分布都将发生根本性变化。具备超高层板量产能力、先进封装基板技术和上游材料配套能力的头部企业，将在这场价值重构中占据最有利的位置。而那些仍停留在4-6层普通硬板赛道的厂商，则面临被时代淘汰的风险。<\/p>

    关键词：<\/strong>英伟达Rubin、PCB价值重构、CoWoP、超高多层板、AI服务器、封装基板、高速SerDes<\/p>


    <\/p>","keyword":null,"desc":"英伟达Rubin架构改写PCB价值坐标 单机价值量飙升至传统服务器3倍以上导语：2026年下半年，英伟达新一代Vera Rubin平台将正式量产出货。这一架构不仅在芯片算力上实现飞跃，更从底层硬件设计层面彻底改写了PCB的价值坐标——从被动","tags":["英伟达","AI服务器"],"views":63,"likes":0,"comments":0,"collects":0,"isreprint":0,"reprinturl":"","reject":null,"invite":null,"createtime":"2026-07-03 16:55:34","updatetime":"2026-07-05 23:47:16","deletetime":null,"orderby":0,"isgiveintegral":1,"istop":0,"day":"03","month":"07"},{"id":124431,"uid":190214,"title":"大族数控披露PCB背钻加工新专利 钻孔设备技术迭代加速高端制造升级","status":2,"categoryid":35,"thumb":"https:\/\/s.coze.cn\/image\/kUva170QTMo\/","multiple_thumb":"","content":"

    大族数控披露PCB背钻加工新专利 钻孔设备技术迭代加速高端制造升级<\/p>

    导语：<\/strong>7月1日，国家知识产权局公示信息显示，大族数控（301200）一项《电路板的背钻加工方法、装置及系统》发明专利于6月30日完成公开。这一专利聚焦PCB高层板孔位加工精度优化，标志着国内PCB钻孔设备技术正进入密集创新期，为AI服务器高多层板制造提供关键工艺支撑。<\/p>

    \"kUva170QTMo\"<\/p>

    一、专利解读：背钻加工精度再升级<\/strong><\/p>

    据捷配PCB（https:\/\/www.jiepei.com\/design\/pcb-news\/）报道，大族数控本次公开的发明专利涉及一种全新的电路板背钻加工方法及系统。背钻是PCB制造中的关键工序，用于去除多层板中多余的stub（残桩），以确保高速信号传输的完整性。随着AI服务器PCB层数从传统8-16层飙升至28-78层，背钻精度要求呈几何级提升——任何微小的深度偏差都可能导致信号反射、阻抗不匹配，直接影响112G\/224G高速SerDes互联的可靠性。<\/p>

    大族数控的新一代背钻方案通过优化加工路径规划和深度控制算法，显著提升了孔位加工精度，同时降低了生产成本。这对于当前AI高多层板产能紧张、交期延长至2-3个月的行业现状，具有重要的工艺降本和效率提升意义。<\/p>

    二、行业背景：钻孔设备成AI时代PCB制造核心环节<\/strong><\/p>

    钻孔是PCB层间互连的核心工序，其精度和效率直接决定了高多层板的良率和产能。AI服务器PCB的钻孔密度从传统服务器的100-200孔\/cm²飙升至300-500孔\/cm²，钻孔深度控制精度要求从±50μm提升至±15μm，对设备性能提出了前所未有的挑战。<\/p>

    与此同时，AI服务器PCB对钻针的消耗量也是传统服务器的5-10倍。单支钻针在AI高层板上的寿命仅500-800孔（传统板为2000-3000孔），钻针价值占比从传统的约1%提升至3%-5%。这意味着钻孔设备与耗材已成为AI时代PCB制造中成本和技术含量双重提升的核心环节。<\/p>

    据行业数据，PCB钻孔设备技术持续迭代，背钻、微孔相关创新专利在2026年上半年密集公示落地，反映出国内设备厂商正在加速追赶海外龙头的技术差距。<\/p>

    三、产业格局：国产设备替代进入加速期<\/strong><\/p>

    全球PCB钻孔设备市场长期被日本、瑞士企业主导，日立、维亚机械、Schmoll等品牌占据高端市场主要份额。但近年来，以大族数控、大族激光为代表的国产厂商在技术突破上取得了显著进展，在高多层板背钻、微孔加工等关键领域逐步缩小与国际水平的差距。<\/p>

    值得关注的是，钻孔设备的技术进步与上游钻针材料的革新形成协同效应。随着日企住友电工宣布9月永久关停PCB专用钨棒产线，日系钻针供给收缩，国内鼎泰高科、金洲精工等钻针龙头迎来市场份额转移窗口，设备与耗材的国产化正在形成良性闭环。<\/p>

    四、延伸展望：设备国产化是高端PCB自主可控的关键一环<\/strong><\/p>

    在国内PCB龙头企业纷纷投入数百亿扩产高端产能的大背景下，制造设备的自主可控显得尤为关键。当前国内PCB扩产资金几乎全部投向AI服务器超高多层板、高阶HDI和IC载板，对配套设备的精度、效率和稳定性提出了更高要求。背钻加工等核心工艺的设备国产化率提升，将有效降低高端PCB的制造成本，缩短交付周期，增强国内产业链的整体竞争力。<\/p>

    关键词：<\/strong>大族数控、PCB背钻、钻孔设备、高多层板、AI服务器、国产替代、高速信号<\/p>


    <\/p>","keyword":null,"desc":"大族数控披露PCB背钻加工新专利 钻孔设备技术迭代加速高端制造升级导语：7月1日，国家知识产权局公示信息显示，大族数控（301200）一项《电路板的背钻加工方法、装置及系统》发明专利于6月30日完成公开。这一专利聚焦PCB高层板孔位加工精度","tags":["大族数控","PCB背钻"],"views":59,"likes":0,"comments":0,"collects":1,"isreprint":0,"reprinturl":"","reject":null,"invite":null,"createtime":"2026-07-03 16:54:47","updatetime":"2026-07-05 23:47:16","deletetime":null,"orderby":0,"isgiveintegral":1,"istop":0,"day":"03","month":"07"}],"notes":[{"id":124432,"uid":190214,"title":"英伟达Rubin架构改写PCB价值坐标 单机价值量飙升至传统服务器3倍以上","status":2,"categoryid":35,"thumb":"https:\/\/s.coze.cn\/image\/W1O5i0ILDPA\/","multiple_thumb":"","content":"

    英伟达Rubin架构改写PCB价值坐标 单机价值量飙升至传统服务器3倍以上<\/p>

    导语：<\/strong>2026年下半年，英伟达新一代Vera Rubin平台将正式量产出货。这一架构不仅在芯片算力上实现飞跃，更从底层硬件设计层面彻底改写了PCB的价值坐标——从被动连接件跃升为芯片最后一层封装载体，单机PCB价值量飙升至传统服务器的3倍以上，行业格局正在经历根本性重塑。<\/p>

    \"W1O5i0ILDPA\"<\/p>

    一、Rubin架构对PCB的颠覆性需求<\/strong><\/p>

    据凤凰网财经（https:\/\/finance.ifeng.com\/c\/8uQTonTGOn0）报道，随着英伟达Hopper迭代至Rubin\/Rubin Ultra架构，叠加谷歌TPU、AMD MI系列ASIC芯片算力密度指数级提升，AI服务器对PCB提出了全新的严苛标准：需要支撑112G\/224G高速SerDes互联，介质损耗控制至Df≤0.002，线宽线距精细度缩小至30μm以内，同时采用密度远超传统产品的盲埋孔、叠孔堆叠结构。<\/p>

    产品规格方面出现明显升级：算力主板、加速卡基板层数普遍提升至18-30层超高多层；整机正交高速背板方案层数可达70-80层，生产端必须配套6阶及以上高阶HDI或mSAP半加成精密工艺。传统服务器PCB仅8-16层，单台价值约650元；而Rubin架构AI服务器的正交背板可达78层，单机PCB价值量飙升至2800-3500元，单机柜PCB价值突破80万元。<\/p>

    二、CoWoP方案：PCB从连接件到封装载体的根本跃迁<\/strong><\/p>

    更具里程碑意义的是，国金证券2026年5月深度报告提出了一个标志性判断：CoWoP（Chip-on-Wafer-on-PCB）方案正在打破PCB与封装基板的边界。该方案去掉传统CoWoS中的ABF封装基板与BGA焊球，将硅中介层与GPU\/HBM直接安装在强化型Platform PCB上——这意味着强化PCB要承担原属封装基板的电气与机械功能，对板材均匀性、翘曲控制、超低损耗介质提出近乎载板级要求。<\/p>

    国金证券分析师在报告中指出：\"这是PCB与封装基板边界消失的标志性事件，标志着PCB从被动连接件向主动封装载体的根本性跃迁。\"虽然量产时间表还存在不确定性，但高端PCB\"承接更多功能\"已是行业共识。这一趋势意味着，未来PCB厂商需要具备传统上与封装基板厂商竞争的技术能力，行业壁垒进一步抬高。<\/p>

    三、市场数据印证：高端板增速碾压低端品类<\/strong><\/p>

    Prismark披露的数据清晰呈现了这种结构性变化：2025年全球PCB总产值预计增长15.8%至851.52亿美元，但内部分化极端——18层及以上超高多层板产值增速高达72.8%；高阶HDI增速26%；而单\/双面板、4-6层常规硬板增速仅约6.2%。<\/p>

    IDC预测，2024-2029年全球服务器市场年均复合增长率将达18.8%，其中加速型服务器支出年均增速达20%以上。以加速型x86为例，2024年全球支出为1130亿美元，预计至2029年将增至3260亿美元，CAGR高达23.7%。这意味着Rubin及后续架构对高端PCB的拉动效应将持续至少5年。<\/p>

    四、延伸展望：PCB行业价值体系正在重构<\/strong><\/p>

    英伟达Rubin架构的量产不仅是一次产品迭代，更是PCB行业价值体系的重构。当PCB从\"电子之母\"的连接件角色，跃升为算力芯片的核心封装载体，整个行业的竞争规则、技术门槛和利润分布都将发生根本性变化。具备超高层板量产能力、先进封装基板技术和上游材料配套能力的头部企业，将在这场价值重构中占据最有利的位置。而那些仍停留在4-6层普通硬板赛道的厂商，则面临被时代淘汰的风险。<\/p>

    关键词：<\/strong>英伟达Rubin、PCB价值重构、CoWoP、超高多层板、AI服务器、封装基板、高速SerDes<\/p>


    <\/p>","keyword":null,"desc":"英伟达Rubin架构改写PCB价值坐标 单机价值量飙升至传统服务器3倍以上导语：2026年下半年，英伟达新一代Vera Rubin平台将正式量产出货。这一架构不仅在芯片算力上实现飞跃，更从底层硬件设计层面彻底改写了PCB的价值坐标——从被动","tags":["英伟达","AI服务器"],"views":63,"likes":0,"comments":0,"collects":0,"isreprint":0,"reprinturl":"","reject":null,"invite":null,"createtime":"2026-07-03 16:55:34","updatetime":"2026-07-05 23:47:16","deletetime":null,"orderby":0,"isgiveintegral":1,"istop":0,"day":"03","month":"07"},{"id":124431,"uid":190214,"title":"大族数控披露PCB背钻加工新专利 钻孔设备技术迭代加速高端制造升级","status":2,"categoryid":35,"thumb":"https:\/\/s.coze.cn\/image\/kUva170QTMo\/","multiple_thumb":"","content":"

    大族数控披露PCB背钻加工新专利 钻孔设备技术迭代加速高端制造升级<\/p>

    导语：<\/strong>7月1日，国家知识产权局公示信息显示，大族数控（301200）一项《电路板的背钻加工方法、装置及系统》发明专利于6月30日完成公开。这一专利聚焦PCB高层板孔位加工精度优化，标志着国内PCB钻孔设备技术正进入密集创新期，为AI服务器高多层板制造提供关键工艺支撑。<\/p>

    \"kUva170QTMo\"<\/p>

    一、专利解读：背钻加工精度再升级<\/strong><\/p>

    据捷配PCB（https:\/\/www.jiepei.com\/design\/pcb-news\/）报道，大族数控本次公开的发明专利涉及一种全新的电路板背钻加工方法及系统。背钻是PCB制造中的关键工序，用于去除多层板中多余的stub（残桩），以确保高速信号传输的完整性。随着AI服务器PCB层数从传统8-16层飙升至28-78层，背钻精度要求呈几何级提升——任何微小的深度偏差都可能导致信号反射、阻抗不匹配，直接影响112G\/224G高速SerDes互联的可靠性。<\/p>

    大族数控的新一代背钻方案通过优化加工路径规划和深度控制算法，显著提升了孔位加工精度，同时降低了生产成本。这对于当前AI高多层板产能紧张、交期延长至2-3个月的行业现状，具有重要的工艺降本和效率提升意义。<\/p>

    二、行业背景：钻孔设备成AI时代PCB制造核心环节<\/strong><\/p>

    钻孔是PCB层间互连的核心工序，其精度和效率直接决定了高多层板的良率和产能。AI服务器PCB的钻孔密度从传统服务器的100-200孔\/cm²飙升至300-500孔\/cm²，钻孔深度控制精度要求从±50μm提升至±15μm，对设备性能提出了前所未有的挑战。<\/p>

    与此同时，AI服务器PCB对钻针的消耗量也是传统服务器的5-10倍。单支钻针在AI高层板上的寿命仅500-800孔（传统板为2000-3000孔），钻针价值占比从传统的约1%提升至3%-5%。这意味着钻孔设备与耗材已成为AI时代PCB制造中成本和技术含量双重提升的核心环节。<\/p>

    据行业数据，PCB钻孔设备技术持续迭代，背钻、微孔相关创新专利在2026年上半年密集公示落地，反映出国内设备厂商正在加速追赶海外龙头的技术差距。<\/p>

    三、产业格局：国产设备替代进入加速期<\/strong><\/p>

    全球PCB钻孔设备市场长期被日本、瑞士企业主导，日立、维亚机械、Schmoll等品牌占据高端市场主要份额。但近年来，以大族数控、大族激光为代表的国产厂商在技术突破上取得了显著进展，在高多层板背钻、微孔加工等关键领域逐步缩小与国际水平的差距。<\/p>

    值得关注的是，钻孔设备的技术进步与上游钻针材料的革新形成协同效应。随着日企住友电工宣布9月永久关停PCB专用钨棒产线，日系钻针供给收缩，国内鼎泰高科、金洲精工等钻针龙头迎来市场份额转移窗口，设备与耗材的国产化正在形成良性闭环。<\/p>

    四、延伸展望：设备国产化是高端PCB自主可控的关键一环<\/strong><\/p>

    在国内PCB龙头企业纷纷投入数百亿扩产高端产能的大背景下，制造设备的自主可控显得尤为关键。当前国内PCB扩产资金几乎全部投向AI服务器超高多层板、高阶HDI和IC载板，对配套设备的精度、效率和稳定性提出了更高要求。背钻加工等核心工艺的设备国产化率提升，将有效降低高端PCB的制造成本，缩短交付周期，增强国内产业链的整体竞争力。<\/p>

    关键词：<\/strong>大族数控、PCB背钻、钻孔设备、高多层板、AI服务器、国产替代、高速信号<\/p>


    <\/p>","keyword":null,"desc":"大族数控披露PCB背钻加工新专利 钻孔设备技术迭代加速高端制造升级导语：7月1日，国家知识产权局公示信息显示，大族数控（301200）一项《电路板的背钻加工方法、装置及系统》发明专利于6月30日完成公开。这一专利聚焦PCB高层板孔位加工精度","tags":["大族数控","PCB背钻"],"views":59,"likes":0,"comments":0,"collects":1,"isreprint":0,"reprinturl":"","reject":null,"invite":null,"createtime":"2026-07-03 16:54:47","updatetime":"2026-07-05 23:47:16","deletetime":null,"orderby":0,"isgiveintegral":1,"istop":0,"day":"03","month":"07"},{"id":124430,"uid":190214,"title":"ABF载板供需缺口2028年将扩至42% 先进封装材料瓶颈卡住AI算力命脉","status":2,"categoryid":35,"thumb":"https:\/\/s.coze.cn\/image\/7kAWfbReFBU\/","multiple_thumb":"","content":"

    ABF载板供需缺口2028年将扩至42% 先进封装材料瓶颈卡住AI算力命脉<\/p>

    导语：<\/strong>当全球目光聚焦英伟达GPU和台积电CoWoS产能时，真正的瓶颈藏在AI供应链最深处——ABF载板。多家国际投行最新预测显示，2026年至2028年全球ABF载板供需缺口将逐年扩大至8%、27%与35%，高端型号缺口甚至高达42%，紧缺周期至少延续4至5年。<\/p>

    \"7kAWfbReFBU\"<\/p>

    一、供需缺口逐年扩大 多家机构一致看紧<\/strong><\/p>

    据捷配PCB（https:\/\/www.jiepei.com\/design\/11267.html）报道，美银证券预估2026至2028年ABF载板缺口分别为8%、27%、35%；高盛预估2026年下半年达10%，2027年扩大至21%，2028年飙升至42%；汇丰给出8%、27%、35%的预测；摩根士丹利则预计2030年长期供需缺口达22%。<\/p>

    需求结构的剧变是核心驱动力。研调机构预估，PC在整体ABF消费中的占比将从2020年的61%骤降至2028年的10%，而AI芯片与服务器CPU的合计占比将攀升至85%。日本载板大厂Ibiden直言，2028年高阶ABF需求面积将较2024年狂飙10.7倍。随着载板层数从4-6层拉升至16-24层，单颗芯片对ABF的消耗量正以远超芯片出货量本身的速度增长。<\/p>

    二、供给端三重刚性瓶颈 远水难解近渴<\/strong><\/p>

    供给端的约束几乎无法打破。第一，全球ABF膜龙头味之素持有全球95%以上市场份额，新工厂计划2028年动工、2032年投产，此前无大规模新产能对冲。味之素已确认ABF薄膜全面涨价30%，高端AI\/HBM型号涨幅或达50%。<\/p>

    第二，扩产周期极其漫长。从建厂、设备到验证往往需要2.5-3年，设备交期已拉长至12-14个月。第三，上游原材料\"雪上加霜\"——关键原料T-glass玻纤布的供应瓶颈至少延续至2027年，进一步制约下游产线释放。<\/p>

    在载板制造端，高阶订单交期已延伸至1.5至2年，客户为锁定产能甚至愿意提供长期资金协助扩产。产业景气可望一路延续至2028年。<\/p>

    三、产业链利润分配：越靠近瓶颈 溢价能力越强<\/strong><\/p>

    ABF产业链的价值分布呈现残酷的\"微笑曲线\"。味之素电子材料业务仅贡献公司总营收的6%，却贡献了整体营业利润的30%，营业利润率超过50%。相比之下，全球载板龙头欣兴电子的毛利率仅15.8%，营业利润率约5%。中游载板制造虽直接受益于需求爆发，却夹在强势的材料供应商和同样强势的芯片客户之间，议价空间有限。<\/p>

    国内方面，华正新材自研CBF复合积层绝缘膜，绕开味之素专利壁垒，是国内唯一通过华为昇腾体系认证并进入小批量供货的国产厂商，良率达85%以上，600万平方米产能预计2026年底投产。但整体国产化率尚不足5%，与味之素99%以上的良率仍有显著差距。<\/p>

    四、延伸展望：国产替代长路漫漫 但方向明确<\/strong><\/p>

    面对味之素的垄断格局，国产替代正在艰难推进。生益科技投资建设高性能基板材料项目，莲花控股切入类ABF膜赛道，激智科技布局精密涂布生产技术。然而，从验证到规模化量产，从5%到足以撼动垄断格局，国产ABF替代仍是一条需要3-5年耐心耕耘的道路。短期看，ABF载板的紧缺格局不可逆转；中长期看，掌握核心材料技术的企业将获得最大的定价权和利润弹性。<\/p>

    关键词：<\/strong>ABF载板、供需缺口、味之素、先进封装、FC-BGA、T-glass、华正新材、国产替代<\/p>


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