{"code":200,"return":true,"data":{"live":[{"id":310,"categoryid":12,"live_data":{"name":"PCB封装设计的重要性及设计注意事项","desc":"\n直播简介：PCB封装是在进行PCB设计","templatetype":2,"authtype":2,"publisherpass":193275,"assistantpass":193275,"foreignpublish":"0","openhostmode":0,"hostloginmode":0,"barrage":"","livestarttime":"2026-10-14 20:00","publishurls":[]},"roomid":"B268C8B50ED550A39C33DC5901307461","title":"PCB封装设计的重要性及设计注意事项","price":"0.00","thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/e4\/f57a429ad942d6885a0f3e7bbc7c86.jpg","orderby":0,"audit":0,"createtime":"2026-10-12 15:01:35","updatetime":"2026-11-03 17:53:58","desc":"直播简介：PCB封装是在进行PCB设计的第一道关卡，没有它无法导入到我们PCB中去进行布局布线，PCB封装要是做得不对，无法和我们的实物进行对应的，可能导致的后果就是板子直接用了，可见这块的重要性。本次直播将详细讲解国创基础资源库的使用方法","content":"

直播简介：<\/span><\/p>

PCB封装是在进行PCB设计的第一道关卡，没有它无法导入到我们PCB中去进行布局布线，PCB封装要是做得不对，无法和我们的实物进行对应的，可能导致的后果就是板子直接用了，可见这块的重要性。本次直播将详细讲解国创基础资源库的使用方法，主要带大家了解封装的各个设计规范及标准.<\/span><\/p>


<\/span><\/p>

直播内容:
1、PCB封装如何定义
2、焊盘的设计及补偿值
3、封装丝印的设计规范
4、PCB封装的快速获取<\/span>
<\/span><\/p>

注册领取免费使用资格，获取官网链接\/直播回放。<\/p>

扫码添加国创客服领取<\/strong><\/p>

\"7aa869c5fdc0bc6de812a4a4b76473.png\"<\/p>","views":1399,"uid":53688,"tags":["PCB封装","PCB设计","布局布线"],"status":2,"reject":null,"playstatus":3,"playtime":"2026-10-14 20:00:00","count":1,"comments":0,"likes":1,"collects":1,"hasreplay":1,"deletetime":null,"isnotify":0,"isgiveintegral":1},{"id":309,"categoryid":10,"live_data":{"name":"别困在PCB！先进封装才是半导体黄金赛道","desc":"直播结束后扫码添加助教领取课件直播介绍：","templatetype":2,"authtype":2,"publisherpass":960650,"assistantpass":960650,"foreignpublish":"0","openhostmode":0,"hostloginmode":0,"barrage":"","livestarttime":"2026-07-31 20:00","publishurls":[]},"roomid":"046C3AAB6E4A23B99C33DC5901307461","title":"别困在PCB！先进封装才是半导体黄金赛道","price":"0.00","thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/7c\/a31123faee9b4e1cdba81f06b8c14f.jpg","orderby":0,"audit":0,"createtime":"2026-07-27 18:02:13","updatetime":"2026-11-03 18:41:12","desc":"直播结束后扫码添加助教领取课件直播介绍：本次直播由弘快科技EDA技术支持部梁老师主讲，围绕PCB工程师向先进封装方向转型展开系统讲解。内容涵盖封装技术演进路径（2.5D、3D、Fan-out、Chiplet）、行业市场数据、岗位需求与薪资水","content":"

直播结束后<\/p>

扫码添加助教领取课件<\/b><\/p>

\"1c41841f13c31cd5c1230e8428a7dc.png\"<\/p>


<\/p>

直播介绍：<\/font><\/b><\/p>

本次直播由弘快科技EDA技术支持部梁老师主讲，围绕PCB工程师向先进封装方向转型展开系统讲解。<\/font><\/p>

内容涵盖封装技术演进路径（2.5D、3D、Fan-out、Chiplet）、行业市场数据、岗位需求与薪资水平，以及国产封装设计工具RedPKG的实际应用能力。<\/font><\/p>

PCB设计工程师具备电路基础、布线经验、信号完整性分析等核心能力，这些技能与封装设计高度相关，转型具有天然优势。直播将说明转型路径、需要补充的知识体系，以及实际落地周期。<\/font><\/p>

适合1-5年经验的PCB设计工程师、考虑转型的电子行业从业者，以及对半导体封装方向感兴趣的在校生和应届毕业生。<\/font><\/p>


<\/font><\/p>工具赋能：RedPKG助力高效封装设计<\/b><\/b><\/font>

• 全流程工艺覆盖：WB\/FC\/2.5D\/Chiplet\/SiP全面支持<\/font><\/p>

• 自动化设计校验：Excel导入、3D预览、DRC\/DFM合规检查<\/font><\/p>

• 仿真分析一体化：SI\/PI\/热仿真无缝集成<\/font><\/p>

• 自主可控信创：兼容国产操作系统与硬件生态<\/font><\/p>

• 实战案例：FCBGA与WBBGA封装项目设计展示<\/font><\/p>


<\/p>

\"184ba88cbda4f56d8a98d827c161fa.png\"<\/p>

\"dd5a9308e611c8b123a6c32f6d96bb.png\"<\/p>

\"6aa6f64c58d0893a4106ded41277a4.png\"<\/p>


<\/p>

\"48aa079da4d11f970e7ac90db85831.png\"<\/p>","views":5535,"uid":198799,"tags":["PCB封装","电子工程师","半导体","3D封装"],"status":2,"reject":null,"playstatus":3,"playtime":"2026-07-31 20:00:00","count":1,"comments":0,"likes":2,"collects":5,"hasreplay":1,"deletetime":null,"isnotify":0,"isgiveintegral":1},{"id":308,"categoryid":12,"live_data":{"name":"PCB设计如何降低开关电源干扰","desc":"直播介绍很多开关电源项目，原理图看起来没","templatetype":2,"authtype":2,"publisherpass":921366,"assistantpass":921366,"foreignpublish":"0","openhostmode":0,"hostloginmode":0,"barrage":"","livestarttime":"2026-07-03 20:00","publishurls":[]},"roomid":"5E6D122E06872DF79C33DC5901307461","title":"PCB设计如何降低开关电源干扰","price":"0.00","thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/1b\/d1d2f5becbe60db0438bdcde70ea55.png","orderby":0,"audit":0,"createtime":"2026-07-02 16:03:43","updatetime":"2026-11-03 18:43:49","desc":"直播介绍很多开关电源项目，原理图看起来没问题，但一到测试就出现纹波偏大、干扰严重、系统不稳定等问题。真正的原因，往往不是芯片选错，而是PCB设计没有控制好电流回路、地回流路径和关键器件布局。本场直播将以BUCK拓扑开关电源为例，从电路工作过","content":"

直播介绍<\/p>

很多开关电源项目，原理图看起来没问题，但一到测试就出现纹波偏大、干扰严重、系统不稳定等问题。真正的原因，往往不是芯片选错，而是PCB设计没有控制好电流回路、地回流路径和关键器件布局。<\/span><\/p>

本场直播将以BUCK拓扑开关电源为例，从电路工作过程讲到地弹产生机理，再结合PCB设计案例，帮助硬件工程师和PCB Layout工程师理解：开关电源干扰到底从哪里来，PCB设计阶段应该怎么提前规避。<\/span><\/p>


<\/span><\/p>直播内容

本场直播会先拆解BUCK降压电路的基本工作过程，包括开关闭合、续流、储能和滤波几个关键状态；然后重点讲解地弹产生原因，说明为什么瞬态电流、磁通量变化和环路面积会直接影响电源干扰；<\/span>如何借助国创基础资源库提升效率与作品规范性；<\/span>最后结合BUCK开关电源PCB案例，分析输入电容、功率器件、电感、二极管、输出电容和地回路的布局布线要点，并在直播末尾进行互动答疑。<\/span><\/p>
主题大纲

  1. BUCK拓扑结构电路介绍<\/strong>
    \n讲清开关闭合、续流阶段的电流路径，以及降压变换器的工作逻辑。\n<\/li>\n
  2. 开关电源干扰的关键来源<\/strong>
    \n从瞬态电流、磁通变化、环路面积理解地弹与噪声产生原因。\n<\/li>\n
  3. PCB设计如何减小地弹影响<\/strong>
    \n围绕高di\/dt回路、接地方式、输入输出电容布局、回流路径进行分析。\n<\/li>\n
  4. BUCK拓扑开关电源PCB案例分析<\/strong>
    \n结合实际Layout案例，拆解器件摆放、功率环路、地回路和关键走线问题。\n<\/li>\n
  5. 交流互动，问题解答<\/strong>
    \n解答开关电源纹波、地弹、干扰、布局布线等常见问题。<\/li>\n<\/ol>

    \"57ee72991f94fbb71defe1008b45e8.png\"<\/p>

    注册领取免费使用资格，获取官网链接\/直播回放。
    扫码添加国创客服领取<\/span>
    <\/p>

    \"7aa869c5fdc0bc6de812a4a4b76473.png\"<\/p>
    ","views":4862,"uid":24529,"tags":["PCB设计","开挂电源","BUCK拓扑","降压变换器","电源设计"],"status":2,"reject":null,"playstatus":3,"playtime":"2026-07-03 20:00:00","count":1,"comments":0,"likes":1,"collects":6,"hasreplay":1,"deletetime":null,"isnotify":0,"isgiveintegral":1},{"id":307,"categoryid":9,"live_data":{"name":"2026年第十九届成图大赛备赛直播讲解","desc":"直播介绍：本次直播将详细讲解国创基础资源","templatetype":2,"authtype":2,"publisherpass":488176,"assistantpass":488176,"foreignpublish":"0","openhostmode":0,"hostloginmode":0,"barrage":"","livestarttime":"2026-05-22 20:00","publishurls":[]},"roomid":"07D42D51AA0146359C33DC5901307461","title":"2026年第十九届成图大赛备赛直播讲解","price":"0.00","thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/b4\/48ad9aad1fce56cd71dcef2f732252.jpg","orderby":0,"audit":0,"createtime":"2026-05-20 11:34:05","updatetime":"2026-11-03 18:52:07","desc":"直播介绍：本次直播将详细讲解国创基础资源库的使用方法，并通过模拟题实操演示，帮助参赛同学高效备赛，提升作品质量，冲刺好成绩！直播大纲：01、直播背景介绍围绕第十九届成图大赛备赛需求，先介绍本次直播的背景与目的，说明赛前库文件准备的重要性;并","content":"

    直播介绍：<\/b><\/p>

    本次直播将详细讲解国创基础资源库的使用方法，并通过模拟题实操演示，帮助参赛同学高效备赛，提升作品质量，冲刺好成绩！<\/p>


    <\/p>

    直播大纲：<\/b>
    01、直播背景介绍
    围绕第十九届成图大赛备赛需求，先介绍本次直播的背景与目的，说明赛前库文件准备的重要性;并结合AI辅助设计趋势，引出如何借助国创基础资源库提升备赛效率与作品规范性。<\/p>


    02、资源库引入
    介绍国创基础资源库，一站式配齐所需数据，大赛期间免费开放，助力高效备赛库的<\/p>


    03、资源库基本功能讲解
    演示元器件库等功能，讲解目录、筛选、预览、多格式下载等操作<\/p>


    <\/p>

    04、模拟题操作演示<\/p>

    结合模拟题进行实操演示，展示资源库在成图大赛备赛中的实际应用<\/p>


    <\/p>

    05直播结尾与福利
    注册领取免费使用资格，获取官网链接\/直播回放。<\/p>

    扫码添加国创客服领取<\/b><\/p>

    \"7aa869c5fdc0bc6de812a4a4b76473.png\"<\/p>","views":7359,"uid":53688,"tags":["电子竞赛","国创资源库","成图大赛","pcb设计","大学生电赛"],"status":2,"reject":null,"playstatus":3,"playtime":"2026-05-22 20:00:00","count":1,"comments":0,"likes":3,"collects":4,"hasreplay":1,"deletetime":null,"isnotify":0,"isgiveintegral":1}],"newCourse":[{"id":22184,"uid":24529,"title":"电源基础入门教程｜从AC\/DC、线性电源到开关电源，零基础系统学电源","desc":"进阶内容扫码联系助教获取","price":"0.00","content":"

    进阶内容<\/p>

    扫码联系助教获取<\/p>

    \"73f11a69938cff46d6103d9a725cfd.png\"<\/p>","orderby":0,"categoryid":16,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/09\/b53eef416d6355ac900e1d9521013f.png","buycount":60,"count":35,"likes":0,"views":610,"comments":0,"collects":6,"reject":null,"invite":0,"createtime":"2026-10-19 11:24:18","updatetime":"2026-11-03 17:10:26","deletetime":null,"tags":["开关电源","线性电源","AC\/DC","变压器","电阻"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22183,"uid":24529,"title":"GPT6真的会PCB自动布线了吗？","desc":"直播课件，扫码添加领取","price":"0.00","content":"

    直播课件，扫码添加领取<\/font><\/b><\/p>

    \"dd45a63b4261f9442395e6a1a6f07d.png\"<\/p>","orderby":0,"categoryid":12,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/a5\/cb8a4102488394f953b5166004ab97.png","buycount":68,"count":1,"likes":0,"views":622,"comments":0,"collects":0,"reject":null,"invite":0,"createtime":"2026-09-17 15:59:04","updatetime":"2026-11-03 16:32:29","deletetime":null,"tags":["PCB","AI","AI画板"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":null,"ipaprice":"0.00"},{"id":22182,"uid":44,"title":"电子设计软件入门到精通实战视频教程集合","desc":"全程手把手教学完整实操案例精选配套案例凡亿实战视频教程试听—大集合，大家可以根据自身情况来选择适合自己的课程，本套课程集合了凡亿教育的所有PCB实战视频的试听。Altium实战视频教程点击购买全套课程：『FY002』Altium 2层显示板","price":"0.00","content":"

    全程手把手教学<\/p>

    完整实操案例<\/p>

    精选配套案例<\/p>

    凡亿实战视频教程试听—大集合，大家可以根据自身情况来选择适合自己的课程，本套课程集合了凡亿教育的所有PCB实战视频的试听。<\/p>


    <\/p>

    Altium实战视频教程<\/strong><\/p>

    点击购买全套课程：<\/strong>『FY002』Altium 2层显示板PCB设计全程实战视频<\/a><\/p>

    点击购买全套课程<\/strong>：<\/strong>『FY003』Altium 4层核心板(菊花链拓扑)PCB设计全程实战视频<\/a><\/p>

    点击购买全套课程<\/strong>：<\/strong>『FY004』Altium 6层核心板全程实战高速PCB设计视频<\/a><\/p>

    点击购买全套课程<\/strong>：<\/strong>『FY005』Altium 8层DDR3高速PCB设计全程实战视频<\/a><\/p>

    点击购买全套课程<\/strong>：<\/strong>『FY006』Altium 6层(全志H8)VR(虚拟现实)PCB设计全程实战视频<\/a><\/p>

    点击购买全套课程<\/strong>：<\/strong>『FY007』Altium 6层PCB视频RK3288平板电脑凡亿PCB实战视频<\/a><\/p>

    点击购买全套课程<\/strong>：<\/strong>『FY017』Altium 两层51单片机电子竞赛PCB实战视频教程<\/a> <\/strong><\/p>

    点击购买全套课程<\/strong>：<\/strong>『FY023』Altium 8层HDI盲埋孔PCB实战视频教程<\/a><\/p>

    点击购买全套课程：<\/strong>『FY027』Altium 18入门速成零基础124讲实战视频教程<\/a><\/p>

    点击购买全套课程：<\/strong>『FY029』Altium Designer 1918 4层stm32主板电子设计<\/a><\/p>

    点击购买全套课程：<\/strong>『FY032』Altium19 2层MAX32660评估板实战视频教程<\/a><\/p>

    点击购买全套课程：<\/strong>『ADMK01』高速PCB模块化课程实战视频教程<\/a><\/p>

    点击购买全套课程：『FY037』AD23 2层4层FPC软硬结合板<\/a><\/strong>
    <\/p>

    点击购买全套课程：<\/strong>『FY039』AD20 6层2片DDR3  T点全志H3机顶盒高速PCB设计实战进阶视频<\/a><\/p>

    点击购买全套课程：<\/strong>『FY043』Altium Designer 20基于DM642的四层达芬奇开发板PCB设计实战视频<\/a><\/p>

    点击购买全套课程：<\/strong>『3DLIB』3D PCB封装库lib集成库实战视频教程常用电子元器件视频<\/a><\/p>

    点击购买全套课程：『FY062』AD22 16层-XILINX-FPGA高端芯片核心板高阶PCB设计<\/a><\/strong><\/p>

    点击购买全套课程：『FY073』AD23高速PCB电路设计8层工控板RK3588项目教程<\/a><\/strong>
    <\/p>

    点击购买全套课程：『FY081』Altium Designer24软件入门150讲基础操作实战<\/a><\/strong>
    <\/p>

    点击购买全套课程：『FY083』16层-XILINX-FPGA高端芯片核心板PCB设计实战教程案例<\/a><\/strong>
    <\/p>

    点击购买全套课程：『FY096』AD26 6层瑞芯微RK3576-AIOT主板PCB设计实训<\/a><\/strong><\/p>


    <\/p>

    Allegro实战视频教程<\/strong>
    <\/p>

    点击购买全套课程<\/strong>：<\/strong>『FY009』Allegro 软件操作130讲实战操作视频<\/a><\/p>

    点击购买全套课程<\/strong>：<\/strong>『FY010』Allegro 4层核心板PCB设计全程实战视频<\/a><\/p>

    点击购买全套课程<\/strong>：<\/strong>『FY011』Allegro 2层IPTV网络电视主板PCB设计全程实战视频<\/a><\/p>

    点击购买全套课程<\/strong>：<\/strong>『FY012』Allegro 8层DDR3高速T点PCB设计全程实战视频<\/a><\/p>

    点击购买全套课程<\/strong>：<\/strong>『FY013』0.4BGA,0.5BGA,0.65 BGA系列出线盲埋孔实战视频<\/a><\/p>

    点击购买全套课程<\/strong>：<\/strong>『FY014』Allegro 6层瑞芯微主控RK3288-MID实战视频<\/a><\/p>

    点击购买全套课程<\/strong>：<\/strong>『FY015』6层叠层阻抗计算速成视频教程<\/a><\/p>

    点击购买全套课程<\/strong>：<\/strong>『FY016』8层allegro DDR3(Fly-By拓扑结构)实战视频<\/a><\/p>

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    2、可以淘宝平台购买之后进行全套视频授权（点击右侧链接打开淘宝店铺→）：https:\/\/item.taobao.com\/item.htm?spm=a1z10.5-c-s.w4002-21870440440.14.5dd06f50eDKaKM&id=598598785207<\/a><\/strong><\/span><\/p>

    3、助教联系方式（微信扫一扫添加）：<\/strong><\/span><\/p>

    <\/p>

    <\/p>","orderby":0,"categoryid":5,"status":2,"keywords":"6层Altium教程","thumb":"https:\/\/api.fanyedu.com\/public\/uploads\/image\/course\/20200804\/ab3e6cd276cc5d14449f08f009a7d1db.jpg","buycount":2,"count":1,"likes":0,"views":5994,"comments":0,"collects":2,"reject":"","invite":0,"createtime":"2020-08-04 11:51:42","updatetime":"2026-11-03 15:37:56","deletetime":null,"tags":["6层Altium教程","Altium教程","PCB培训"],"annex":null,"hot":0,"isgiveintegral":0,"ipaid":"course_9999","ipaprice":"328.80"},{"id":21238,"uid":24529,"title":"Altium Designer 23 2层4层FPC软硬结合板 AD23实战视频教程","desc":"","price":"158.00","content":"

    \"O1CN0146gZRi1lWoOZbGakn_!!3973574827.jpg\"\"O1CN01o4vu1I1lWoOhrOh2E_!!3973574827.jpg\"<\/p>

    \"b184b25d0c74a680909609ba939736.png\"\"O1CN01cOVUY51lWod2uP07Z_!!3973574827.jpg\"\"O1CN01sIJGnk1lWoOhuYvtn_!!3973574827.jpg\"\"98dc868cc8fec6316f2847a8a511a4.png\"<\/p>
    ","orderby":0,"categoryid":5,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/65\/92e3279eb66efa489b189604ab4de9.jpg","buycount":10,"count":27,"likes":0,"views":6200,"comments":0,"collects":13,"reject":null,"invite":0,"createtime":"2023-03-23 10:18:58","updatetime":"2026-11-03 16:13:06","deletetime":null,"tags":["FPC","软板","AD23","EDA设计","PCB制版"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":"course_9999","ipaprice":"158.00"},{"id":21057,"uid":24529,"title":"Allegro pcb封装实战视频教程","desc":"扫码添加助教老师获取课程学习文件添加时备注：封装素材","price":"189.00","content":"

    扫码添加助教老师<\/p>

    获取课程学习文件<\/b><\/p>

    添加时备注：封装素材<\/b><\/p>

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    ","orderby":0,"categoryid":6,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/13\/55fb90cb1f0701d4f5dbf965441945.jpg","buycount":14,"count":54,"likes":0,"views":4799,"comments":0,"collects":11,"reject":null,"invite":0,"createtime":"2022-12-01 14:23:32","updatetime":"2026-11-03 17:30:54","deletetime":null,"tags":["PCB封装","PCB设计","PCB画板","电路设计"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":0,"ipaid":"course_9999","ipaprice":"189.00"},{"id":21435,"uid":30525,"title":"【第九期】射频电路实战特训班","desc":"","price":"6999.00","content":"

    \"O1CN012Ii9OJ1J7ngUQqrtG_!!2207926780982.jpg\"\/\"O1CN01CcqIyz1J7ni5nJaX5_!!2207926780982.jpg\"\/\"6ff62bfb608f33b90e9fddbe6f38c5.png\"\/\"O1CN01LAW91R1J7ni32XHKE_!!2207926780982.jpg\"\/\"O1CN01eycWOX1J7ngQ6rYuV_!!2207926780982.jpg\"\/\"88f84deeccb32bca71d4f0753ac6ac.png\"\/\"O1CN01eycWOX1J7ngQ6rYuV_!!2207926780982.jpg\"\/\"86b90108c1d7a3bcd22a6fdcb86c08.png\"\/\"O1CN01kkkHHh1J7ngSD7hil_!!2207926780982.jpg\"\/\"567c77fdffe079fbdf120cdd9ed2b4.png\"\/\"O1CN01HHz6CO1J7ngZ58oLQ_!!2207926780982.jpg\"\/\"14fc8c71fdc467a21c917c13722670.png\"\/\"O1CN01lMRnvD1J7nhiaTyJw_!!2207926780982.jpg\"\/<\/p>","orderby":0,"categoryid":17,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/09\/5e911e4c1082fa95806837dd4620ef.jpg","buycount":52,"count":34,"likes":1,"views":10360,"comments":0,"collects":10,"reject":null,"invite":0,"createtime":"2023-08-29 17:23:17","updatetime":"2026-11-03 18:35:56","deletetime":null,"tags":["射频","天线","版图设计","ADS","微波"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":"course_9999","ipaprice":"6999.00"},{"id":20516,"uid":58261,"title":"EMC电磁兼容零基础静电诊断防护理论与实战教程","desc":"大量典型案列，直接与项目EMC难题面对面交手。","price":"599.00","content":"

    <\/p>

    <\/p>

    <\/p>

    <\/p>

    <\/p>

    <\/p>

    <\/p>

    <\/p>

    <\/p>

    <\/p>

    <\/p>

    <\/p>

    <\/p>

    <\/p>","orderby":0,"categoryid":33,"status":2,"keywords":"EMC 电磁兼容零基础进阶实战教学 静电防护理论经验实战","thumb":"https:\/\/api.fanyedu.com\/public\/uploads\/image\/course\/20210127\/8e5534e15566853fb7fe9d35c531c87c.jpg","buycount":2,"count":1,"likes":0,"views":6531,"comments":0,"collects":5,"reject":"","invite":0,"createtime":"2021-01-27 15:55:23","updatetime":"2026-11-03 16:14:20","deletetime":null,"tags":["EMC设计","电磁兼容","电磁兼容基础理论"],"annex":null,"hot":0,"isgiveintegral":0,"ipaid":"course_9999","ipaprice":"599.00"},{"id":21571,"uid":24529,"title":"高效对PCB进行信号完整性的仿真与优化","desc":"要点：1.高速PCB在设计中常见的问题；2.高速PCB的特殊材料要求；3.高速信号传输的特征和挑战4.高速PCB设计的原则和考虑因素5.PCB设计存在问题6.高速信号仿真分析工具有那些7.项目实例，高速PCB的信号完整性仿真办法和技巧","price":"9.90","content":"

    要点：<\/b><\/p>

    1.高速PCB在设计中常见的问题；
    2.高速PCB的特殊材料要求；
    3.高速信号传输的特征和挑战
    4.高速PCB设计的原则和考虑因素
    5.PCB设计存在问题
    6.高速信号仿真分析工具有那些
    7.项目实例，高速PCB的信号完整性仿真办法和技巧<\/p>

    \"6a0229bd1124623847d9962f46ce9e.png\"\"86741d9c9a5dffe6ea90bd59f05ef8.png\"\"ad005441394b6a78866173d14c9444.png\"<\/p>
    ","orderby":0,"categoryid":20,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/b7\/8e54b165a2ad978cd791d0f249381b.jpg","buycount":5,"count":1,"likes":0,"views":3365,"comments":0,"collects":5,"reject":null,"invite":0,"createtime":"2024-04-11 11:34:41","updatetime":"2026-11-03 18:47:32","deletetime":null,"tags":["高速PCB","高速仿真","信号完整性"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":"course_99","ipaprice":"9.90"},{"id":21412,"uid":24869,"title":"Cadence Sigrity 高速信号互连|电源|完整性仿真","desc":"Cadence Sigrity 高速信号互连|电源|完整性仿真","price":"299.00","content":"

    Cadence Sigrity 高速信号互连|电源|完整性仿真<\/p>","orderby":0,"categoryid":20,"status":2,"keywords":null,"thumb":"https:\/\/api.fanyedu.com\/uploads\/image\/a8\/0c41ce26da0c851cd804fb42afefdd.png","buycount":20,"count":10,"likes":1,"views":4813,"comments":0,"collects":6,"reject":null,"invite":0,"createtime":"2023-08-09 10:05:55","updatetime":"2026-11-03 17:43:11","deletetime":null,"tags":["仿真","Cadence Sigrity","高速信号","电源","完整性仿真"],"annex":{"type":"0","url":"","pwd":""},"hot":0,"isgiveintegral":1,"ipaid":"course_9999","ipaprice":"299.00"}],"article":[{"id":125891,"uid":190214,"title":"村田微型射频连接器压缩PCB测试占板空间","status":1,"categoryid":35,"thumb":"https:\/\/api.fanyedu.com\/uploads\/ueditor\/image\/20261103\/1793693681480830.png","multiple_thumb":"","content":"

    村田微型射频连接器压缩PCB测试占板空间<\/h1>

    资讯日期：2026年10月29日｜原创行业新闻整理<\/p>

    \"AI生成示意图\"
    AI生成示意图｜500×350像素<\/figcaption><\/figure>

    导语<\/h2>

    村田制作所宣布，旗下SWL系列两款带开关射频同轴连接器已开始量产。产品尺寸为1.0毫米×1.0毫米×0.55毫米，相较公司此前SWJ系列，连接器本身的PCB安装面积减少约40%；与专用探针配合时，包含测量避让区在内的占用面积减少约60%。这类器件面向智能手机、穿戴设备等空间受限的无线产品，针对的是射频电路测试接口带来的板面布局压力。<\/p><\/section>

    新闻事实<\/h2>

    公司资料显示，两款型号分别为MM8330-2600RJ5和MM8330-2600RK20，支持直流至15GHz频率范围，标称阻抗为50欧姆。新器件采用村田所称的独有结构设计，将射频与机械设计结合，以在缩小体积的同时维持传输损耗和机械强度表现。配套自动探针和手动探针预计于2026年12月开始量产。旧款SWJ系列尺寸为1.4毫米×1.2毫米×0.65毫米，厂商据此计算出新产品的面积节省比例。<\/p><\/section>

    行业观察<\/h2>

    在高密度PCB上，测试连接器的实际占位不只取决于元件焊盘，还受到探针进入角度、周边器件间距、射频走线和外壳结构约束。更小的接口可能为天线调试、产线测试点和其他元器件腾出布局空间，也有助于减少设计阶段对测试位置的妥协。但器件尺寸缩小并不能单独保证射频性能或可制造性，工程团队仍需结合目标频段、阻抗连续性、探针寿命、装配公差和测试流程进行验证。<\/p><\/section>

    后续展望<\/h2>

    下一阶段可观察专用探针量产后，客户在新设计中的采用情况，以及接口方案是否扩展到更多无线终端。对硬件开发团队而言，设计初期同步考虑测试可达性，往往比后期压缩测试区更稳妥。实际导入还涉及板边净空、返修条件、探针接触稳定性和测试程序兼容性，工程样机阶段的数据将比单一尺寸参数更能反映系统价值。若节省出的空间被用于天线净空或其他关键器件布局，设计收益还要通过整机射频测试确认。工程端还需要评估探针接触点的可重复定位和长期磨损表现。该产品公告反映的是一项元器件尺寸和测试占板空间优化，不应理解为整机PCB可直接等比例缩小。本文为产业资讯整理与分析，不构成采购或投资建议。<\/p><\/section>

    来源：<\/strong>村田制作所产品公告（2026年10月29日）<\/a>SWL系列产品介绍<\/a><\/div>

    本文配图为AI生成示意图，不代表真实厂区、设备或官方数据图表。<\/small><\/p><\/article>

    <\/p>","keyword":null,"desc":"村田微型射频连接器压缩PCB测试占板空间资讯日期：2026年10月29日｜原创行业新闻整理AI生成示意图｜500×350像素导语村田制作所宣布，旗下SWL系列两款带开关射频同轴连接器已开始量产。产品尺寸为1.0毫米×1.0毫米×0.55毫米","tags":["1"],"views":0,"likes":0,"comments":0,"collects":0,"isreprint":null,"reprinturl":null,"reject":null,"invite":0,"createtime":"2026-11-03 16:15:36","updatetime":"2026-11-03 16:15:36","deletetime":null,"orderby":0,"isgiveintegral":0,"istop":0,"day":"03","month":"11"},{"id":125890,"uid":190214,"title":"村田五年计划投入约一万亿日元扩充MLCC产能","status":1,"categoryid":35,"thumb":"https:\/\/api.fanyedu.com\/uploads\/ueditor\/image\/20261103\/1793693623497151.png","multiple_thumb":"","content":"

    村田五年计划投入约一万亿日元扩充MLCC产能<\/h1>

    资讯日期：2026年10月30日｜原创行业新闻整理<\/p>

    \"AI生成示意图\"
    AI生成示意图｜500×350像素<\/figcaption><\/figure>

    导语<\/h2>

    村田制作所10月30日公布多层陶瓷电容器（MLCC）中长期扩产计划，拟在2026至2030财年投入约1万亿日元，提升全球生产能力。公司预期2030财年MLCC销售额达到2025财年的两倍以上。数据中心是当前需求来源之一，村田同时提及边缘设备、移动出行和机器人等未来应用，计划覆盖日本及海外多个既有生产基地。<\/p><\/section>

    新闻事实<\/h2>

    村田披露，计划投资中约3500亿日元用于厂房建设，约6500亿日元用于生产设备，具体包括在日本及海外既有生产点新建厂房、导入设备、扩充现有设备能力并取得部分土地。日本冈山村田制造所计划新建MLCC生产厂房及相关材料厂房，首期建设预计2027年4月开始，厂房目标于2028年底完工；相关原材料生产设施计划于2030年完成。公司还表示，泰国及菲律宾生产据点将进行投资，部分现有工厂也将逐年增配设备。<\/p><\/section>

    行业观察<\/h2>

    MLCC广泛用于电源去耦、滤波和电压稳定，服务器主板、加速卡、电源模块及通信设备均需要大量被动元件。AI硬件运算密度提升后，供电网络和高速信号系统的复杂度也随之提高，特定规格、高可靠性器件的需求可能增加。扩产计划体现厂商对中长期需求的判断，不过五年投资周期较长，厂房建设、设备交付、材料采购、人员训练和客户验证都需时间，规划产能不会立刻转化为可用供应。<\/p><\/section>

    后续展望<\/h2>

    对PCB和整机企业来说，观察重点不仅是新增总产能，也包括不同尺寸、额定电压、温度等级和可靠性规格的实际供货安排。MLCC在电源电路中常用于去耦、滤波和瞬态响应优化，电容器的封装、额定值与布局仍需按具体电路验证，不能只按数量替代。服务器电源、主板和加速卡对电容的组合需求也不完全相同，设计端通常要依据纹波、电压瞬态和工作温度进行选型。未来还需看新厂建设节点、设备爬坡和下游认证进展。若需求增速或终端产品结构发生变化，企业也可能调整扩产节奏。当前公告说明的是村田的资本与产能规划，不代表市场短期内已经出现普遍短缺或价格变化。本文为产业资讯整理与分析，不构成采购或投资建议。<\/p><\/section>

    来源：<\/strong>村田制作所官方扩产公告（2026年10月30日）<\/a>村田制作所新闻中心<\/a><\/div>

    本文配图为AI生成示意图，不代表真实厂区、设备或官方数据图表。<\/small><\/p><\/article>

    <\/p>","keyword":null,"desc":"村田五年计划投入约一万亿日元扩充MLCC产能资讯日期：2026年10月30日｜原创行业新闻整理AI生成示意图｜500×350像素导语村田制作所10月30日公布多层陶瓷电容器（MLCC）中长期扩产计划，拟在2026至2030财年投入约1万亿日","tags":["1"],"views":0,"likes":0,"comments":0,"collects":0,"isreprint":null,"reprinturl":null,"reject":null,"invite":0,"createtime":"2026-11-03 16:14:12","updatetime":"2026-11-03 16:14:12","deletetime":null,"orderby":0,"isgiveintegral":0,"istop":0,"day":"03","month":"11"},{"id":125889,"uid":190214,"title":"三井金属提前扩大极薄铜箔产能应对AI需求","status":1,"categoryid":35,"thumb":"https:\/\/api.fanyedu.com\/uploads\/ueditor\/image\/20261103\/1793693562557924.png","multiple_thumb":"","content":"

    三井金属提前扩大极薄铜箔产能应对AI需求<\/h1>

    资讯日期：2026年10月30日｜原创行业新闻整理<\/p>

    \"AI生成示意图\"
    AI生成示意图｜500×350像素<\/figcaption><\/figure>

    导语<\/h2>

    三井金属10月30日宣布，将提前提升MicroThin™载体铜箔的生产能力，以回应半导体封装基板、光模块及通信基础设施用多层板需求增长。公司更新了原有扩产节奏，目标是在2028财年将月产能提高至620万平方米，较此前计划进一步上调。该变化把产业关注点从PCB成品板延伸到更上游的关键材料，也反映AI服务器需求正沿供应链向材料端传导。<\/p><\/section>

    新闻事实<\/h2>

    根据公司公告，MicroThin™在日本上尾工厂和马来西亚工厂生产。此前公司提出2028财年月产能达到600万平方米的目标；最新安排调整为2026财年下半年520万平方米、2027财年560万平方米、2028财年620万平方米。三井金属表示，将通过提前实施上尾工厂生产效率提升和部分设备配置来加快计划，预计不需要大规模追加资本支出。公司所述需求来自数据中心和存储器应用所用的半导体封装基板，同时也包括光电融合发展带动的通信基础设施多层PCB及高速通信柔性板。<\/p><\/section>

    行业观察<\/h2>

    载体铜箔厚度薄、表面处理和尺寸控制要求高，是细线路形成的重要材料之一。随着封装基板和高速互连板向更高布线密度发展，铜箔对线路精细度、附着可靠性和加工稳定性的影响更加突出。若材料产能提前释放，可能缓解部分客户对高端材料交期的压力，但公告中的月产能力是公司规划值，不等于当期可销售产量；设备安装、产品认证、良率爬坡以及下游订单结构仍会影响实际供货。<\/p><\/section>

    后续展望<\/h2>

    后续值得关注的指标包括各财年目标能否按期达成、客户认证进度及新增产量中面向封装基板、光模块和PCB的比例。对PCB厂和硬件制造商而言，上游材料安排也会影响高层板、HDI及高速通信产品的排产。载体铜箔项目从工艺验证到批量导入通常还需与客户规格、层压流程和线路加工窗口配合，因此下游应用放量与材料端产能节奏需要同步观察。现阶段可确认的是企业调整了扩产路线和时间表，至于供需何时趋于平衡，还需结合行业实际开工、良率及终端订单观察。本文为产业资讯整理与分析，不构成采购或投资建议。<\/p><\/section>

    来源：<\/strong>三井金属官方公告（2026年10月30日）<\/a>此前MicroThin产能计划<\/a><\/div>

    本文配图为AI生成示意图，不代表真实厂区、设备或官方数据图表。<\/small><\/p><\/article>

    <\/p>","keyword":null,"desc":"三井金属提前扩大极薄铜箔产能应对AI需求资讯日期：2026年10月30日｜原创行业新闻整理AI生成示意图｜500×350像素导语三井金属10月30日宣布，将提前提升MicroThin™载体铜箔的生产能力，以回应半导体封装基板、光模块及通信基","tags":["1"],"views":0,"likes":0,"comments":0,"collects":0,"isreprint":null,"reprinturl":null,"reject":null,"invite":0,"createtime":"2026-11-03 16:13:12","updatetime":"2026-11-03 16:13:12","deletetime":null,"orderby":0,"isgiveintegral":0,"istop":0,"day":"03","month":"11"}],"notes":[{"id":125891,"uid":190214,"title":"村田微型射频连接器压缩PCB测试占板空间","status":1,"categoryid":35,"thumb":"https:\/\/api.fanyedu.com\/uploads\/ueditor\/image\/20261103\/1793693681480830.png","multiple_thumb":"","content":"

    村田微型射频连接器压缩PCB测试占板空间<\/h1>

    资讯日期：2026年10月29日｜原创行业新闻整理<\/p>

    \"AI生成示意图\"
    AI生成示意图｜500×350像素<\/figcaption><\/figure>

    导语<\/h2>

    村田制作所宣布，旗下SWL系列两款带开关射频同轴连接器已开始量产。产品尺寸为1.0毫米×1.0毫米×0.55毫米，相较公司此前SWJ系列，连接器本身的PCB安装面积减少约40%；与专用探针配合时，包含测量避让区在内的占用面积减少约60%。这类器件面向智能手机、穿戴设备等空间受限的无线产品，针对的是射频电路测试接口带来的板面布局压力。<\/p><\/section>

    新闻事实<\/h2>

    公司资料显示，两款型号分别为MM8330-2600RJ5和MM8330-2600RK20，支持直流至15GHz频率范围，标称阻抗为50欧姆。新器件采用村田所称的独有结构设计，将射频与机械设计结合，以在缩小体积的同时维持传输损耗和机械强度表现。配套自动探针和手动探针预计于2026年12月开始量产。旧款SWJ系列尺寸为1.4毫米×1.2毫米×0.65毫米，厂商据此计算出新产品的面积节省比例。<\/p><\/section>

    行业观察<\/h2>

    在高密度PCB上，测试连接器的实际占位不只取决于元件焊盘，还受到探针进入角度、周边器件间距、射频走线和外壳结构约束。更小的接口可能为天线调试、产线测试点和其他元器件腾出布局空间，也有助于减少设计阶段对测试位置的妥协。但器件尺寸缩小并不能单独保证射频性能或可制造性，工程团队仍需结合目标频段、阻抗连续性、探针寿命、装配公差和测试流程进行验证。<\/p><\/section>

    后续展望<\/h2>

    下一阶段可观察专用探针量产后，客户在新设计中的采用情况，以及接口方案是否扩展到更多无线终端。对硬件开发团队而言，设计初期同步考虑测试可达性，往往比后期压缩测试区更稳妥。实际导入还涉及板边净空、返修条件、探针接触稳定性和测试程序兼容性，工程样机阶段的数据将比单一尺寸参数更能反映系统价值。若节省出的空间被用于天线净空或其他关键器件布局，设计收益还要通过整机射频测试确认。工程端还需要评估探针接触点的可重复定位和长期磨损表现。该产品公告反映的是一项元器件尺寸和测试占板空间优化，不应理解为整机PCB可直接等比例缩小。本文为产业资讯整理与分析，不构成采购或投资建议。<\/p><\/section>

    来源：<\/strong>村田制作所产品公告（2026年10月29日）<\/a>SWL系列产品介绍<\/a><\/div>

    本文配图为AI生成示意图，不代表真实厂区、设备或官方数据图表。<\/small><\/p><\/article>

    <\/p>","keyword":null,"desc":"村田微型射频连接器压缩PCB测试占板空间资讯日期：2026年10月29日｜原创行业新闻整理AI生成示意图｜500×350像素导语村田制作所宣布，旗下SWL系列两款带开关射频同轴连接器已开始量产。产品尺寸为1.0毫米×1.0毫米×0.55毫米","tags":["1"],"views":0,"likes":0,"comments":0,"collects":0,"isreprint":null,"reprinturl":null,"reject":null,"invite":0,"createtime":"2026-11-03 16:15:36","updatetime":"2026-11-03 16:15:36","deletetime":null,"orderby":0,"isgiveintegral":0,"istop":0,"day":"03","month":"11"},{"id":125890,"uid":190214,"title":"村田五年计划投入约一万亿日元扩充MLCC产能","status":1,"categoryid":35,"thumb":"https:\/\/api.fanyedu.com\/uploads\/ueditor\/image\/20261103\/1793693623497151.png","multiple_thumb":"","content":"

    村田五年计划投入约一万亿日元扩充MLCC产能<\/h1>

    资讯日期：2026年10月30日｜原创行业新闻整理<\/p>

    \"AI生成示意图\"
    AI生成示意图｜500×350像素<\/figcaption><\/figure>

    导语<\/h2>

    村田制作所10月30日公布多层陶瓷电容器（MLCC）中长期扩产计划，拟在2026至2030财年投入约1万亿日元，提升全球生产能力。公司预期2030财年MLCC销售额达到2025财年的两倍以上。数据中心是当前需求来源之一，村田同时提及边缘设备、移动出行和机器人等未来应用，计划覆盖日本及海外多个既有生产基地。<\/p><\/section>

    新闻事实<\/h2>

    村田披露，计划投资中约3500亿日元用于厂房建设，约6500亿日元用于生产设备，具体包括在日本及海外既有生产点新建厂房、导入设备、扩充现有设备能力并取得部分土地。日本冈山村田制造所计划新建MLCC生产厂房及相关材料厂房，首期建设预计2027年4月开始，厂房目标于2028年底完工；相关原材料生产设施计划于2030年完成。公司还表示，泰国及菲律宾生产据点将进行投资，部分现有工厂也将逐年增配设备。<\/p><\/section>

    行业观察<\/h2>

    MLCC广泛用于电源去耦、滤波和电压稳定，服务器主板、加速卡、电源模块及通信设备均需要大量被动元件。AI硬件运算密度提升后，供电网络和高速信号系统的复杂度也随之提高，特定规格、高可靠性器件的需求可能增加。扩产计划体现厂商对中长期需求的判断，不过五年投资周期较长，厂房建设、设备交付、材料采购、人员训练和客户验证都需时间，规划产能不会立刻转化为可用供应。<\/p><\/section>

    后续展望<\/h2>

    对PCB和整机企业来说，观察重点不仅是新增总产能，也包括不同尺寸、额定电压、温度等级和可靠性规格的实际供货安排。MLCC在电源电路中常用于去耦、滤波和瞬态响应优化，电容器的封装、额定值与布局仍需按具体电路验证，不能只按数量替代。服务器电源、主板和加速卡对电容的组合需求也不完全相同，设计端通常要依据纹波、电压瞬态和工作温度进行选型。未来还需看新厂建设节点、设备爬坡和下游认证进展。若需求增速或终端产品结构发生变化，企业也可能调整扩产节奏。当前公告说明的是村田的资本与产能规划，不代表市场短期内已经出现普遍短缺或价格变化。本文为产业资讯整理与分析，不构成采购或投资建议。<\/p><\/section>

    来源：<\/strong>村田制作所官方扩产公告（2026年10月30日）<\/a>村田制作所新闻中心<\/a><\/div>

    本文配图为AI生成示意图，不代表真实厂区、设备或官方数据图表。<\/small><\/p><\/article>

    <\/p>","keyword":null,"desc":"村田五年计划投入约一万亿日元扩充MLCC产能资讯日期：2026年10月30日｜原创行业新闻整理AI生成示意图｜500×350像素导语村田制作所10月30日公布多层陶瓷电容器（MLCC）中长期扩产计划，拟在2026至2030财年投入约1万亿日","tags":["1"],"views":0,"likes":0,"comments":0,"collects":0,"isreprint":null,"reprinturl":null,"reject":null,"invite":0,"createtime":"2026-11-03 16:14:12","updatetime":"2026-11-03 16:14:12","deletetime":null,"orderby":0,"isgiveintegral":0,"istop":0,"day":"03","month":"11"},{"id":125889,"uid":190214,"title":"三井金属提前扩大极薄铜箔产能应对AI需求","status":1,"categoryid":35,"thumb":"https:\/\/api.fanyedu.com\/uploads\/ueditor\/image\/20261103\/1793693562557924.png","multiple_thumb":"","content":"

    三井金属提前扩大极薄铜箔产能应对AI需求<\/h1>

    资讯日期：2026年10月30日｜原创行业新闻整理<\/p>

    \"AI生成示意图\"
    AI生成示意图｜500×350像素<\/figcaption><\/figure>

    导语<\/h2>

    三井金属10月30日宣布，将提前提升MicroThin™载体铜箔的生产能力，以回应半导体封装基板、光模块及通信基础设施用多层板需求增长。公司更新了原有扩产节奏，目标是在2028财年将月产能提高至620万平方米，较此前计划进一步上调。该变化把产业关注点从PCB成品板延伸到更上游的关键材料，也反映AI服务器需求正沿供应链向材料端传导。<\/p><\/section>

    新闻事实<\/h2>

    根据公司公告，MicroThin™在日本上尾工厂和马来西亚工厂生产。此前公司提出2028财年月产能达到600万平方米的目标；最新安排调整为2026财年下半年520万平方米、2027财年560万平方米、2028财年620万平方米。三井金属表示，将通过提前实施上尾工厂生产效率提升和部分设备配置来加快计划，预计不需要大规模追加资本支出。公司所述需求来自数据中心和存储器应用所用的半导体封装基板，同时也包括光电融合发展带动的通信基础设施多层PCB及高速通信柔性板。<\/p><\/section>

    行业观察<\/h2>

    载体铜箔厚度薄、表面处理和尺寸控制要求高，是细线路形成的重要材料之一。随着封装基板和高速互连板向更高布线密度发展，铜箔对线路精细度、附着可靠性和加工稳定性的影响更加突出。若材料产能提前释放，可能缓解部分客户对高端材料交期的压力，但公告中的月产能力是公司规划值，不等于当期可销售产量；设备安装、产品认证、良率爬坡以及下游订单结构仍会影响实际供货。<\/p><\/section>

    后续展望<\/h2>

    后续值得关注的指标包括各财年目标能否按期达成、客户认证进度及新增产量中面向封装基板、光模块和PCB的比例。对PCB厂和硬件制造商而言，上游材料安排也会影响高层板、HDI及高速通信产品的排产。载体铜箔项目从工艺验证到批量导入通常还需与客户规格、层压流程和线路加工窗口配合，因此下游应用放量与材料端产能节奏需要同步观察。现阶段可确认的是企业调整了扩产路线和时间表，至于供需何时趋于平衡，还需结合行业实际开工、良率及终端订单观察。本文为产业资讯整理与分析，不构成采购或投资建议。<\/p><\/section>

    来源：<\/strong>三井金属官方公告（2026年10月30日）<\/a>此前MicroThin产能计划<\/a><\/div>

    本文配图为AI生成示意图，不代表真实厂区、设备或官方数据图表。<\/small><\/p><\/article>

    <\/p>","keyword":null,"desc":"三井金属提前扩大极薄铜箔产能应对AI需求资讯日期：2026年10月30日｜原创行业新闻整理AI生成示意图｜500×350像素导语三井金属10月30日宣布，将提前提升MicroThin™载体铜箔的生产能力，以回应半导体封装基板、光模块及通信基","tags":["1"],"views":0,"likes":0,"comments":0,"collects":0,"isreprint":null,"reprinturl":null,"reject":null,"invite":0,"createtime":"2026-11-03 16:13:12","updatetime":"2026-11-03 16:13:12","deletetime":null,"orderby":0,"isgiveintegral":0,"istop":0,"day":"03","month":"11"}]}}